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TLV2221IDBVRG4

Texas Instruments

TLV2221IDBVRG4 by Texas Instruments

TLV2221IDBVRG4 by Texas Instruments is a CMOS Operational Amplifier with 3000uV Max Input Offset Voltage, 82dB Nominal CMRR, and 480kHz Unity Gain Bandwidth. Ideal for industrial applications requiring low-bias amplification in compact designs due to its micropower consumption and small form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,853 parts In-Stock

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5,853

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Chip Stock

USA . 5,670 parts In-Stock

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5,670

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Digiode

USA . 2,297 parts In-Stock

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2,297

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Cyclops Electronics Ltd

UK . 1,028 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,227 parts In-Stock

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$3.410

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$3.410

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Parana Technologies

USA . 510 parts In-Stock

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$4.113

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$4.567

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510

$4.113

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$4.567

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DigiPath Technology Company

USA . 884 parts In-Stock

1+ parts

$4.529

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$4.166

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884

$4.529

$4.166

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ChromeModa Solutions

Germany . 5,126 parts In-Stock

1+ parts

$4.621

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$3.789

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$4.621

$3.789

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IDEA Electronic Components Group

UK . 96 parts In-Stock

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$4.621

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$4.159

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96

$4.621

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$4.159

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One Stop Electronics

USA . 1,183 parts In-Stock

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$7.410

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AZTECH Wire

Italy . 562 parts In-Stock

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$8.009

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$8.009

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A-Z Elektronik GmbH

Germany . 9,394 parts In-Stock

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Kepictronics

USA . 3,800 parts In-Stock

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Argo Parts USA

USA . 2,934 parts In-Stock

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Lixinc

USA . 2,823 parts In-Stock

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Continental Prestige Electronics

USA . 2,023 parts In-Stock

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Microchip USA

USA . 1,728 parts In-Stock

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1,728

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Bastille Electronics

Australia . 750 parts In-Stock

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750

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Corphita

USA . 676 parts In-Stock

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676

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Overview

Discover the cutting-edge TLV2221IDBVRG4 by Texas Instruments, a top-of-the-line Operational Amplifier designed for precision performance and reliability. Renowned for their exceptional quality and innovation in the industry, Texas Instruments delivers unmatched value to customers seeking superior electronic components. Ideal for a wide range of applications, this Op Amp boasts a compact design and low power consumption, making it perfect for industrial-grade projects requiring high efficiency and accuracy. Elevate your circuits with the TLV2221IDBVRG4 and experience next-level performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage ensures accurate signal processing.

Maximum Average Bias Current (IIB): 0.00015 uA

Low bias current helps in minimizing power consumption and improving efficiency.

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on circuit boards.

Nominal Common Mode Reject Ratio: 82 dB

High common mode rejection ratio helps in reducing noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 3

Operates at a nominal supply voltage of 3V, making it suitable for low-power applications.

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type provides high gain and accuracy for signal amplification.

Technical Specifications

Operational Amplifiers (Op Amps) TLV2221IDBVRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

480 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

82 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

3000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.18 V/us

Maximum Input Offset Current (IIO):

150 pA

Peak Bias Current:

150 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

12 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

75 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV2221IDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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