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TLV1391CDBVRE4

Texas Instruments

TLV1391CDBVRE4 by Texas Instruments

TLV1391CDBVRE4 by Texas Instruments is a comparator with a max input offset voltage of 9000 uV and max average bias current of -0.4 uA. It operates at a nominal voltage of 3V, making it suitable for applications requiring precise voltage comparisons in commercial-grade environments. The device features an open-collector output type and compact small outline package style for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,732 parts In-Stock

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Digiode

USA . 4,932 parts In-Stock

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Parana Technologies

USA . 2,142 parts In-Stock

1+ parts

$3.151

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$3.669

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$3.151

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$3.669

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DigiPath Technology Company

USA . 778 parts In-Stock

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$3.469

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$3.192

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778

$3.469

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ChromeModa Solutions

Germany . 2,012 parts In-Stock

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$3.540

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$2.903

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2,012

$3.540

$2.903

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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$3.540

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$3.186

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429

$3.540

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$3.186

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One Stop Electronics

USA . 1,214 parts In-Stock

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$9.410

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$9.410

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AZTECH Wire

Italy . 216 parts In-Stock

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$18.709

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QUARKTWIN TECHNOLOGY LTD

USA . 17,220 parts In-Stock

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Microchip USA

USA . 4,126 parts In-Stock

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Corphita

USA . 266 parts In-Stock

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Overview

Discover the unmatched precision and reliability of the TLV1391CDBVRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and performance in every product they create. The TLV1391CDBVRE4 is a versatile comparator that is perfect for a wide range of applications, providing customers with unparalleled value and benefits. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Unlock new possibilities with the TLV1391CDBVRE4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and helps in protecting the internal components of the comparator.

Maximum Input Offset Voltage: 9000 uV

The high maximum input offset voltage allows for more precise voltage comparison, making this comparator suitable for applications requiring high accuracy.

Maximum Average Bias Current (IIB): -0.4 uA

The low maximum average bias current helps in minimizing power consumption and ensuring efficient operation of the comparator.

Surface Mount: YES

Being surface mountable makes installation and integration of this comparator easier, especially in compact electronic devices where space is limited.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V allows for compatibility with a wide range of electronic circuits and systems.

Power Supplies (V): 3/5

The availability of power supplies at both 3V and 5V gives flexibility in choosing the appropriate voltage for different applications.

No. of Terminals: 5

Having 5 terminals enables easy connection and interfacing with other components, enhancing the versatility of this comparator.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this comparator can withstand harsh environmental conditions and industrial applications.

Output Type: OPEN-COLLECTOR

The open-collector output type allows for easy interfacing with microcontrollers and digital circuits, offering flexibility in signal processing.

Maximum Seated Height: 1.45 mm

The compact maximum seated height makes this comparator suitable for applications where space constraints are a concern.

Technical Specifications

Comparators TLV1391CDBVRE4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

-400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

150 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

700 ns

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV1391CDBVRE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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