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TLV1704AMPWTPSEP

Texas Instruments

TLV1704AMPWTPSEP by Texas Instruments

TLV1704AMPWTPSEP by Texas Instruments is a comparator with 4 functions, featuring a max input offset voltage of 2500 uV and a max supply voltage limit of 40 V. Ideal for military applications due to its bipolar technology, small outline package style, and open-collector output type.

Median Price

$106.814

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,538 parts In-Stock

1+ parts

$106.814

100+ parts

$62.832

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12,538

$106.814

$62.832

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$78.180

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500

$78.180

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Digiode

USA . 1,551 parts In-Stock

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$101.473

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1,551

$101.473

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Vyrian

USA . 7,380 parts In-Stock

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7,380

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Distributors (Availability)

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Corohmni

South Africa . 529 parts In-Stock

1+ parts

$1.976

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529

$1.976

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Parana Technologies

USA . 1,240 parts In-Stock

1+ parts

$4.623

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$5.094

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1,240

$4.623

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$5.094

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DigiPath Technology Company

USA . 1,342 parts In-Stock

1+ parts

$5.090

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1,342

$5.090

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ChromeModa Solutions

Germany . 6,954 parts In-Stock

1+ parts

$5.194

100+ parts

$4.259

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6,954

$5.194

$4.259

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IDEA Electronic Components Group

UK . 1,415 parts In-Stock

1+ parts

$5.194

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$4.675

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1,415

$5.194

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$4.675

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AZTECH Wire

Italy . 213 parts In-Stock

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$16.890

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$16.890

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Continental Prestige Electronics

USA . 6,091 parts In-Stock

1+ parts

$78.180

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$76.616

6,091

$78.180

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$76.616

Netroflash

USA . 50 parts In-Stock

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$78.180

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$76.616

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50

$78.180

$76.616

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Advanced Electronics

New Zealand . 34 parts In-Stock

1+ parts

$79.744

100+ parts

$79.744

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$79.744

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34

$79.744

$79.744

$79.744

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Ampacity Inc.

Singapore . 12,456 parts In-Stock

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$90.790

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$90.790

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Corphita

USA . 1,194 parts In-Stock

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$96.133

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Argo Parts USA

USA . 4,612 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,608 parts In-Stock

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4,608

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Overview

Discover the Texas Instruments TLV1704AMPWTPSEP, a high-quality comparator designed for precision applications. With a reputation for excellence in manufacturing, Texas Instruments delivers a product that exceeds expectations. Ideal for a variety of industries, this comparator offers unparalleled value with its fast response time and low bias current. Trust in Texas Instruments for reliable solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Maximum Input Offset Voltage: 2500 uV

The high maximum input offset voltage allows for more accurate and precise signal processing.

Maximum Average Bias Current (IIB): 0.02 uA

With a low average bias current, this product consumes minimal power, making it energy-efficient.

Surface Mount: YES

Being surface mountable, this product is easy to integrate into circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in one device simplifies circuit design and reduces component count, leading to cost savings.

Package Shape: RECTANGULAR

The rectangular shape of the package provides efficient use of space and allows for easy placement on circuit boards.

No. of Terminals: 14

The high number of terminals enables versatile connectivity options and allows for complex circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space and provides a compact footprint for tight layouts.

Maximum Supply Voltage Limit: 40 V

The high maximum supply voltage limit ensures compatibility with a wide range of power sources, making the product versatile.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, increasing its reliability.

Maximum Bias Current (IIB) @25°C: 0.015 uA

The low bias current at 25°C ensures stable and accurate performance of the product under varying temperature conditions.

Output Type: OPEN-COLLECTOR

The open-collector output type allows for easy interfacing with other circuitry and provides flexibility in signal handling.

Nominal Response Time: 560 ns

The fast nominal response time enables rapid signal processing and quick decision-making in real-time applications.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this product can function in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Having dual terminal positions makes installation and connection easier, enhancing the usability of the product.

Maximum Seated Height: 1.2 mm

With a low maximum seated height, this product is suitable for compact designs and applications with limited space.

Width: 4.4 mm

The narrow width of the product allows for high-density mounting on circuit boards, maximizing space utilization.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C allows for reliable soldering in lead-free assembly processes.

Length: 5 mm

The compact length of the product minimizes the footprint on circuit boards, making it suitable for space-constrained applications.

Temperature Grade: MILITARY

Designed for military-grade applications, this product offers high reliability and performance in extreme conditions.

Technology: BIPOLAR

Utilizing bipolar technology ensures high speed and precision in signal processing, making it ideal for critical applications.

Terminal Form: GULL WING

The gull wing terminal form provides a robust connection and facilitates automated assembly processes, improving production efficiency.

Amplifier Type: COMPARATOR

As a comparator, this product is suitable for comparing two analog signals and making quick decisions based on voltage levels, essential for many applications.

Terminal Pitch: 0.65 mm

The tight terminal pitch of 0.65 mm allows for high-density mounting and precise connections, enabling compact and reliable circuit designs.

Moisture Sensitivity Level (MSL): 2

With a low MSL of 2, this product is less sensitive to moisture ingress during storage and handling, enhancing its reliability.

Technical Specifications

Comparators TLV1704AMPWTPSEP attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

2.5 mV

Peak Bias Current:

20 nA

Maximum Bias Current (IIB) @25 °C:

15 nA

Operational Characteristics

Maximum Supply Voltage:

40 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

560 ns

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TLV1704AMPWTPSEP Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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