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TLV3401IDBVRG4

Texas Instruments

TLV3401IDBVRG4 by Texas Instruments

TLV3401IDBVRG4 by Texas Instruments is a comparator with 4400uV max input offset voltage, 0.0015uA max average bias current, and 175000ns nominal response time. Widely used in automotive applications due to its small outline package style and low power consumption of 0.00064mA at 5V supply voltage.

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Chip Stock

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Vyrian

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Digiode

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One Stop Electronics

USA . 585 parts In-Stock

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$3.410

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Parana Technologies

USA . 1,095 parts In-Stock

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$3.816

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$354.403

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$3.435

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DigiPath Technology Company

USA . 1,449 parts In-Stock

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$4.202

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$3.866

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ChromeModa Solutions

Germany . 2,260 parts In-Stock

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$4.288

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$3.516

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IDEA Electronic Components Group

UK . 331 parts In-Stock

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$3.859

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$6.230

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$5.919

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Corohmni

South Africa . 457 parts In-Stock

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Ampacity Inc.

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AZTECH Wire

Italy . 656 parts In-Stock

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Component Stockers USA

USA . 687 parts In-Stock

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Overview

Unlock unparalleled performance and precision with the Texas Instruments TLV3401IDBVRG4 Comparator. Crafted with cutting-edge technology and expertise, this comparator boasts unmatched quality and reliability, perfect for a wide range of applications. From automotive to industrial, this compact device delivers exceptional value, providing customers with superior accuracy, efficiency, and control. Elevate your projects with the TLV3401IDBVRG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 4400 uV

The high maximum input offset voltage ensures accurate and precise signal processing, making it reliable for critical operations.

Maximum Average Bias Current (IIB): 0.0015 uA

With a low maximum average bias current, the product consumes minimal power, making it energy-efficient.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for compatibility with various electronics and PCB designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, making it compatible with common power sources.

Power Supplies (V): +-1.35/+-8/2.7/16

Supports a wide range of power supply voltages, providing flexibility in different operational environments.

No. of Terminals: 5

The limited number of terminals simplifies the connection and installation process, reducing complexity in wiring.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style enhance the product's compactness and suitability for space-constrained applications.

Maximum Supply Voltage Limit: 17 V

The high maximum supply voltage limit ensures the product's durability and protection against overvoltage scenarios.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for automotive and industrial applications where heat resistance is essential.

Maximum Bias Current (IIB) @25°C: 0.0001 uA

With an ultra-low maximum bias current, the product maintains stability and accuracy in signal processing even under varying temperatures.

Output Type: OPEN-DRAIN

The open-drain output type allows for easy interfacing with other components and devices, enhancing compatibility and versatility.

Nominal Response Time: 175000 ns

The fast nominal response time ensures quick and efficient signal processing, suitable for time-sensitive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish enhances the product's reliability, corrosion resistance, and electrical conductivity.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit design and layout, accommodating various connection configurations.

Maximum Seated Height: 1.45 mm

With a low maximum seated height, the product offers a compact profile for space-saving installation in slim devices.

Width: 1.6 mm

The narrow width of the product makes it suitable for applications where space is limited, such as portable electronics.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the reflow soldering process without damage, ensuring reliable assembly.

Length: 2.9 mm

The short length of the product contributes to its compactness and ease of integration into tight spaces.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature requirements, ensuring reliability and performance in vehicle applications.

Maximum Negative Supply Voltage Limit: 0 V

The maximum negative supply voltage limit protects the product from reverse polarity and potential damage in the circuit.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and secure solder joints, enhancing the product's durability and reliability.

Amplifier Type: COMPARATOR

As a comparator amplifier, the product is ideal for comparing two different voltage signals, making it suitable for a wide range of voltage-level detection applications.

Maximum Supply Current: 0.00064 mA

With a low maximum supply current, the product operates efficiently and conserves power, extending battery life in portable devices.

Nominal Negative Supply Voltage (Vsup): 0 V

The nominal negative supply voltage of 0V simplifies the power configuration and ensures compatibility with single-supply applications.

Packing Method: TR

The TR packing method offers secure and organized packaging for transportation and storage, ensuring product integrity and ease of handling.

Terminal Pitch: 0.95 mm

The narrow terminal pitch allows for compact spacing between terminals, facilitating precise connections and reducing the risk of short circuits.

Technical Specifications

Comparators TLV3401IDBVRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

4.4 mV

Peak Bias Current:

1.5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Maximum Supply Current:

640 nA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

17 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

175 µs

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV3401IDBVRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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