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TLC7528IFNRG3

Texas Instruments

TLC7528IFNRG3 by Texas Instruments

TLC7528IFNRG3 by Texas Instruments is an 8-bit D/A converter with max analog output voltage of ±10V, settling time of 0.1us, and linearity error of 0.3906%. Ideal for applications requiring precise voltage outputs in industrial automation systems or test equipment due to its high accuracy and fast settling time.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,798 parts In-Stock

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3,798

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Vyrian

USA . 3,469 parts In-Stock

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3,469

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 439 parts In-Stock

1+ parts

$10.000

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439

$10.000

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AZTECH Wire

Italy . 528 parts In-Stock

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$12.718

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528

$12.718

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Parana Technologies

USA . 493 parts In-Stock

1+ parts

$16.647

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$16.912

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493

$16.647

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$16.912

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DigiPath Technology Company

USA . 1,778 parts In-Stock

1+ parts

$18.330

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1,778

$18.330

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ChromeModa Solutions

Germany . 1,615 parts In-Stock

1+ parts

$18.704

100+ parts

$15.337

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1,615

$18.704

$15.337

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$18.704

100+ parts

$17.769

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$16.834

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41

$18.704

$17.769

$16.834

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Corphita

USA . 4,960 parts In-Stock

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4,960

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Microchip USA

USA . 4,363 parts In-Stock

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4,363

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Overview

Unlock the power of precision with the Texas Instruments TLC7528IFNRG3 Digital-to-Analog Converter. Crafted by industry leader Texas Instruments, this cutting-edge device boasts unparalleled quality and reliability. Ideal for a wide range of applications, this converter delivers a maximum analog output voltage of 10V and features a quick settling time of just 0.1 us. With its compact chip carrier package and versatile input format, the TLC7528IFNRG3 offers customers exceptional value, efficiency, and performance for all their digital-to-analog conversion needs. Experience the difference with Texas Instruments TLC7528IFNRG3 today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

The high maximum analog output voltage of 10V allows for a wide range of output signal levels, making this product versatile for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability of the product while keeping it lightweight.

No. of Bits: 8

Having 8 bits allows for a resolution of 2^8=256 levels of output voltage, providing precise and accurate analog signal conversion.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can withstand elevated temperatures, making it suitable for various environments.

Technical Specifications

Digital-to-Analog Converters TLC7528IFNRG3 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.3906 %

Nominal Settling Time (tstl):

100 ns

Maximum Supply Current:

2 mA

Maximum Settling Time:

100 ns

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5/15 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J20

Trade Compliance

TLC7528IFNRG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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