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TLC7524IFNRG3

Texas Instruments

TLC7524IFNRG3 by Texas Instruments

TLC7524IFNRG3 by Texas Instruments is an 8-bit D/A converter with max analog output voltage of ±10V, settling time of 0.1us, and linearity error of 0.1953%. Ideal for applications requiring precise voltage outputs in industrial automation and test equipment due to its high accuracy and fast settling time.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,817 parts In-Stock

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Digiode

USA . 4,919 parts In-Stock

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4,919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,003 parts In-Stock

1+ parts

$2.000

100+ parts

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1,003

$2.000

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AZTECH Wire

Italy . 518 parts In-Stock

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$6.620

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518

$6.620

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Parana Technologies

USA . 484 parts In-Stock

1+ parts

$10.863

100+ parts

$1,008.826

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$9.777

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484

$10.863

$1,008.826

$9.777

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DigiPath Technology Company

USA . 908 parts In-Stock

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$11.962

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908

$11.962

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ChromeModa Solutions

Germany . 6,697 parts In-Stock

1+ parts

$12.206

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$10.009

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6,697

$12.206

$10.009

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IDEA Electronic Components Group

UK . 1,754 parts In-Stock

1+ parts

$12.206

100+ parts

$11.596

1k+ parts

$10.985

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1,754

$12.206

$11.596

$10.985

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Corphita

USA . 4,796 parts In-Stock

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Microchip USA

USA . 431 parts In-Stock

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Overview

Experience unparalleled precision and performance with the TLC7524IFNRG3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This digital-to-analog converter is perfect for a wide range of applications, offering a maximum analog output voltage of 10 V and a quick settling time of just 0.1 us. With its compact chip carrier package style and versatile input formats, this product provides exceptional value and benefits to customers looking for superior accuracy and efficiency in their designs. Choose Texas Instruments for cutting-edge technology that delivers unmatched results.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

The high maximum analog output voltage of 10V allows for a wide range of output levels, making this product versatile for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the digital-to-analog converter.

Surface Mount: YES

Being surface mountable makes installation and assembly of this digital-to-analog converter easy and efficient.

No. of Bits: 8

The 8-bit resolution ensures precise and accurate conversion from digital to analog signals.

Maximum Settling Time: 0.1 us

With a fast maximum settling time of 0.1 us, this converter can quickly stabilize the output signal, reducing distortion and improving performance.

Maximum Linearity Error (EL): 0.1953%

The low maximum linearity error ensures that the output signal closely matches the input signal, maintaining accuracy in signal conversion.

Power Supplies (V): 5/15

The flexibility of operating with power supplies of 5V or 15V allows for compatibility with a variety of systems and setups.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and efficient design, perfect for space-constrained applications.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range of 85°C ensures reliability and stability in varying environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C allows for reliable performance even in cold environments.

Terminal Position: QUAD

The quad terminal position provides stable connectivity and ease of integration into circuit systems.

Maximum Seated Height: 4.57 mm

With a low maximum seated height, this digital-to-analog converter can be easily installed in compact spaces.

Width: 8.965 mm

The compact width of 8.965 mm allows for efficient use of board space in electronic systems.

Minimum Analog Output Voltage: -10 V

The ability to output a minimum voltage of -10V expands the range of signals that can be accurately converted by this product.

Length: 8.965 mm

The short length of 8.965 mm contributes to the overall compact design of this digital-to-analog converter.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and reliable performance in digital-to-analog signal conversion.

Terminal Form: J BEND

The J bend terminal form allows for secure and stable connections in the circuit system.

Maximum Supply Current: 2 mA

With a low maximum supply current of 2 mA, this converter consumes minimal power while ensuring efficient operation.

Input Format: PARALLEL, 8 BITS

Supporting parallel input with 8 bits enables quick and easy data transfer for precise analog output signals.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product is designed to accurately convert digital signals into analog output, making it a reliable choice for signal processing applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm facilitates precise connections and layout in circuit boards, improving overall system performance.

Input Bit Code: BINARY, OFFSET BINARY

Supporting binary and offset binary input bit codes provides flexibility in signal processing and compatibility with various data formats.

Technical Specifications

Digital-to-Analog Converters TLC7524IFNRG3 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, Offset Binary

Maximum Linearity Error (EL):

0.1953 %

Nominal Settling Time (tstl):

100 ns

Maximum Supply Current:

2 mA

Maximum Settling Time:

100 ns

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5/15 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

20

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-J20

Trade Compliance

TLC7524IFNRG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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