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TLC556MJ

Texas Instruments

TLC556MJ by Texas Instruments

TLC556MJ by Texas Instruments is a dual-function analog waveform generator with a max output frequency of 1.2 GHz, suitable for military-grade applications. It operates within a temperature range of -55 to 125 °C and requires power supplies of 5/18 V. The package style is in-line with 14 terminals and CMOS technology.

Median Price

$14.638

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 75 parts In-Stock

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$14.638

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Vyrian

USA . 7,695 parts In-Stock

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Digiode

USA . 1,526 parts In-Stock

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TME

Poland . 100 parts In-Stock

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$16.053

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North Shore Components

USA . 35 parts In-Stock

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Bristol Electronics

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Flex Direct, LLC

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Distributors (Availability)

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Parana Technologies

USA . 839 parts In-Stock

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$2.059

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$2.581

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$2.059

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DigiPath Technology Company

USA . 1,702 parts In-Stock

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$2.268

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$2.086

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IDEA Electronic Components Group

UK . 1,851 parts In-Stock

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$2.314

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$2.083

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ChromeModa Solutions

Germany . 746 parts In-Stock

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$2.314

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$1.897

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One Stop Electronics

USA . 1,326 parts In-Stock

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$5.500

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AZTECH Wire

Italy . 517 parts In-Stock

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$14.038

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Authorized Procurement Solutions

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Corphita

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Assy Fe

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Overview

Discover the exceptional quality and reliability of the TLC556MJ by Texas Instruments, a leading manufacturer in analog waveform generation. This versatile product offers dual functions in a durable ceramic, glass-sealed package, making it ideal for a wide range of applications. From military-grade screening to a wide supply voltage range, this component provides value and benefits that customers can trust. Whether you need pulse or rectangular waveforms, the TLC556MJ delivers high performance with ease. Elevate your projects with this top-notch solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection to the internal components, ensuring long-term reliability.

Maximum Output Frequency: 1.2 GHz

High output frequency allows for generating a wide range of analog waveforms efficiently.

Nominal Supply Voltage (Vsup): 5 V

Matches standard voltage requirements, making it compatible with a wide range of systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for demanding operational environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Analog Waveform Generation TLC556MJ attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15V NOMINAL

Other IC type:

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/18

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Current (Isup):

1.4 mA

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

TLC556MJ Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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