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STWD100PPW83E

STMicroelectronics

STWD100PPW83E by STMicroelectronics

STWD100PPW83E by STMicroelectronics is an Analog Waveform Generation IC with 3/5V power supplies, operating from -40 to 125 °C. It features a small outline package with dual terminals and gull wing form, suitable for automotive applications requiring precise waveform generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,878 parts In-Stock

1+ parts

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2,878

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Vyrian

USA . 2,131 parts In-Stock

1+ parts

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2,131

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Digiode

USA . 700 parts In-Stock

1+ parts

-

100+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 56 parts In-Stock

1+ parts

$22.536

100+ parts

-

1k+ parts

$20.283

10k+ parts

-

56

$22.536

-

$20.283

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MKK Technologies

India . 334 parts In-Stock

1+ parts

$42.378

100+ parts

-

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10k+ parts

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334

$42.378

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DigiPath Technology Company

USA . 334 parts In-Stock

1+ parts

$42.378

100+ parts

-

1k+ parts

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10k+ parts

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334

$42.378

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Corphita

USA . 3,085 parts In-Stock

1+ parts

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3,085

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Parana Technologies

USA . 1,228 parts In-Stock

1+ parts

-

100+ parts

$26.946

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10k+ parts

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1,228

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$26.946

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Overview

Elevate your analog waveform generation capabilities with the STWD100PPW83E by STMicroelectronics. Crafted with precision and quality, this product offers unrivaled performance and reliability for a wide range of applications. From automotive to industrial settings, this compact device delivers seamless power supplies and maximum operating temperatures, ensuring optimal functionality in any environment. Trust in STMicroelectronics' expertise and experience in semiconductor solutions, and unlock the potential of your projects with the STWD100PPW83E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Power Supplies (V): 3/5

The availability of multiple power supply options (3V or 5V) provides flexibility in compatibility with different systems and voltage requirements.

No. of Terminals: 5

The presence of 5 terminals allows for multiple connections and functionalities, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make the product compact and space-saving, suitable for applications with limited space constraints.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand high-temperature environments, ensuring reliability and performance in various conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to operate effectively in cold environments, making it suitable for a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position offers additional connection options and allows for more flexibility in circuit design and configuration.

Temperature Grade: AUTOMOTIVE

Being automotive temperature grade rated ensures that the product meets the stringent requirements for automotive applications, guaranteeing performance and reliability in automotive environments.

Terminal Form: GULL WING

The gull wing terminal form makes soldering and mounting the product onto circuit boards easier and more secure, ensuring a reliable connection.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635 mm allows for high-density mounting, enabling more components to be placed closely together on a circuit board for compact designs.

Technical Specifications

Analog Waveform Generation STWD100PPW83E attributes and parameters. Explore more Analog Waveform Generation devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G5

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

STWD100PPW83E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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