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LM556MD8

Texas Instruments

LM556MD8 by Texas Instruments

LM556MD8 by Texas Instruments is a TIMER IC with BIPOLAR technology. It operates b/w -55°C to 125°C, with Vsup ranging from 4.5V to 16V and Isup up to 14mA. Ideal for Analog Waveform Generation applications due to its surface mount package and rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 947 parts In-Stock

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947

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Digiode

USA . 928 parts In-Stock

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928

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Anansix

USA . 735 parts In-Stock

1+ parts

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735

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,337 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,337

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 358 parts In-Stock

1+ parts

$4.500

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-

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358

$4.500

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Ampacity Inc.

Singapore . 1,232 parts In-Stock

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$7.500

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1,232

$7.500

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Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

$7.919

100+ parts

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$8.476

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2,041

$7.919

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$8.476

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ChromeModa Solutions

Germany . 3,675 parts In-Stock

1+ parts

$8.898

100+ parts

$7.296

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3,675

$8.898

$7.296

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IDEA Electronic Components Group

UK . 5 parts In-Stock

1+ parts

$8.898

100+ parts

$8.453

1k+ parts

$8.008

10k+ parts

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5

$8.898

$8.453

$8.008

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AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$8.916

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590

$8.916

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Argo Parts USA

USA . 3,269 parts In-Stock

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3,269

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DigiPath Technology Company

USA . 1,736 parts In-Stock

1+ parts

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$8.022

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1,736

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$8.022

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Continental Prestige Electronics

USA . 1,639 parts In-Stock

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1,639

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Corphita

USA . 1,435 parts In-Stock

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1,435

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Bastille Electronics

Australia . 66 parts In-Stock

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66

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Corohmni

South Africa . 33 parts In-Stock

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33

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Overview

Unleash the power of precision waveform generation with the LM556MD8 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments excels in providing cutting-edge solutions for analog waveform generation. Whether you're working on audio equipment, communications systems, or test instruments, the LM556MD8 offers unmatched performance and accuracy. Say goodbye to guesswork and hello to seamless operation with this advanced timer IC. Elevate your projects with the LM556MD8 and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for mass production and installation.

Package Shape: RECTANGULAR

The rectangular package shape allows for compact integration into electronic circuits, saving space and improving overall design flexibility.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage makes the product compatible with a wide range of electronic systems and components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers protection and easy handling during assembly, ensuring reliability and longevity of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain consistent performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range allows the product to function reliably in cold environments without sacrificing performance.

Terminal Position: UPPER

The upper terminal position provides convenient access for connections and facilitates PCB layout, simplifying installation and maintenance.

Other IC type: TIMER

The integration of timer functionality adds versatility to the product, enabling precise timing control in waveform generation applications.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement allows the product to operate efficiently with minimal power consumption, ideal for battery-operated devices.

Maximum Supply Current (Isup): 14 mA

The low maximum supply current ensures energy efficiency and helps prevent overheating, contributing to the product's overall reliability and longevity.

Technology: BIPOLAR

Bipolar technology offers high precision and stability in waveform generation, making the product suitable for applications that require accurate signal output.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failure, improving overall product reliability.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage tolerance provides flexibility in power source selection and allows the product to be used in a wide range of electronic systems.

Technical Specifications

Analog Waveform Generation LM556MD8 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XUCC-N

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Supply Current (Isup):

14 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LM556MD8 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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