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TLC556CD1

Texas Instruments

TLC556CD1 by Texas Instruments

TLC556CD1 by Texas Instruments is a CMOS analog waveform generator with 14 terminals, operating at temperatures from 0 to 70°C. It has power supplies of 5/18V and is surface mountable in a small outline package. Ideal for commercial applications requiring precise waveform generation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,080 parts In-Stock

1+ parts

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4,080

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Digiode

USA . 739 parts In-Stock

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739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 355 parts In-Stock

1+ parts

$0.500

100+ parts

-

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355

$0.500

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Parana Technologies

USA . 1,015 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

$1.882

10k+ parts

-

1,015

$0.999

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$1.882

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ChromeModa Solutions

Germany . 5,146 parts In-Stock

1+ parts

$1.123

100+ parts

$0.921

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5,146

$1.123

$0.921

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IDEA Electronic Components Group

UK . 55 parts In-Stock

1+ parts

$1.123

100+ parts

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1k+ parts

$1.011

10k+ parts

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55

$1.123

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$1.011

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Semicontronic

India . 814 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

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814

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 874 parts In-Stock

1+ parts

$5.500

100+ parts

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874

$5.500

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AZTECH Wire

Italy . 635 parts In-Stock

1+ parts

$12.967

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635

$12.967

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DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

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100+ parts

$1.012

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974

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$1.012

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Corphita

USA . 595 parts In-Stock

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595

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Corohmni

South Africa . 446 parts In-Stock

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446

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Overview

Experience unparalleled quality and reliability with the TLC556CD1 analog waveform generator by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that exceeds expectations. Perfect for a wide range of applications, this product offers customers exceptional value, precision, and performance. Whether you're a professional engineer or an electronics enthusiast, the TLC556CD1 is sure to meet all your needs with its superior design and functionality. Trust Texas Instruments to provide you with the best in analog waveform generation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the product.

Surface Mount: YES

Being surface mount compatible makes it easier to integrate this product into circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, making it easier to design and optimize the layout.

Power Supplies (V): 5/18

The availability of multiple power supply options (5V and 18V) provides flexibility for different applications and power requirements.

No. of Terminals: 14

With 14 terminals, this product offers a wide range of connection options and functionalities for versatile use in various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-saving integration of this product in compact electronic devices and systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures that this product can function effectively in a wide range of temperature environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and backup connectivity, enhancing the reliability and durability of the product.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product is suitable for use in standard commercial applications and environments.

Technology: CMOS

The CMOS technology used in this product allows for low power consumption, high speed, and compatibility with various digital and analog systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto circuit boards, ensuring reliable connections and preventing signal interference.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact layout design on circuit boards, enabling efficient connections and signal routing.

Technical Specifications

Analog Waveform Generation TLC556CD1 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/18

Qualification:

Not Qualified

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TLC556CD1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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