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TLC555CPWLE

Texas Instruments

TLC555CPWLE by Texas Instruments

TLC555CPWLE by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 2-15V and max output frequency of 2.1 GHz. This CMOS technology-based IC, in a small outline package, is ideal for pulse generation applications requiring precise timing control at temperatures ranging from 0 to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,518 parts In-Stock

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Digiode

USA . 3,332 parts In-Stock

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3,332

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,318 parts In-Stock

1+ parts

$3.500

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1,318

$3.500

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One Stop Electronics

USA . 158 parts In-Stock

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$4.500

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158

$4.500

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Aztec Data Supply Inc.

USA . 316 parts In-Stock

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$8.585

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316

$8.585

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AZTECH Wire

Italy . 891 parts In-Stock

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$11.181

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891

$11.181

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Parana Technologies

USA . 1,682 parts In-Stock

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$20.047

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$19.979

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1,682

$20.047

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$19.979

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DigiPath Technology Company

USA . 1,555 parts In-Stock

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$22.074

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$20.309

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1,555

$22.074

$20.309

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ChromeModa Solutions

Germany . 1,469 parts In-Stock

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$22.525

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$18.470

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$22.525

$18.470

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IDEA Electronic Components Group

UK . 226 parts In-Stock

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$22.525

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$21.399

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$20.272

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226

$22.525

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$20.272

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Corphita

USA . 2,929 parts In-Stock

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Continental Prestige Electronics

USA . 2,563 parts In-Stock

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Argo Parts USA

USA . 1,673 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Overview

Discover endless possibilities with the TLC555CPWLE by Texas Instruments, a cutting-edge Analog Waveform Generation product that sets new standards in performance and reliability. Manufactured by the renowned Texas Instruments, this product offers unparalleled quality and innovation. From pulse generation to rectangular waveforms, this versatile component caters to a wide range of applications. Experience superior value and benefits with the TLC555CPWLE - unleash its power and transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the waveform generator, making it resistant to shock and vibration.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the waveform generator onto circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard voltage of 5V makes this waveform generator compatible with a wide range of electronic devices, ensuring ease of integration.

Maximum Output Frequency: 2.1 GHz

With a high maximum output frequency of 2.1 GHz, this waveform generator can generate complex waveforms at high speeds, making it suitable for demanding applications.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2V allows for flexibility in power supply options, making it suitable for battery-operated devices and low-power applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and performance in various environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Built with CMOS technology, this waveform generator offers low power consumption and high integration capabilities, making it energy-efficient and compact for space-constrained designs.

Technical Specifications

Analog Waveform Generation TLC555CPWLE attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 2V OR 15V NOMINALS

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

2.1 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TLC555CPWLE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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