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TLC551CDG4

Texas Instruments

TLC551CDG4 by Texas Instruments

TLC551CDG4 by Texas Instruments is an Analog Waveform Generation IC with 1.2 GHz output frequency, operating from 1V to 15V. It has a small outline package, suitable for pulse and rectangular wave generation applications in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,762 parts In-Stock

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7,762

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Digiode

USA . 3,066 parts In-Stock

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3,066

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Distributors (Availability)

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One Stop Electronics

USA . 1,461 parts In-Stock

1+ parts

$0.500

100+ parts

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1,461

$0.500

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Ampacity Inc.

Singapore . 625 parts In-Stock

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$3.500

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625

$3.500

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Semicontronic

India . 962 parts In-Stock

1+ parts

$5.500

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$5.362

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$5.335

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962

$5.500

$5.362

$5.335

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Parana Technologies

USA . 1,970 parts In-Stock

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$10.434

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$10.948

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1,970

$10.434

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$10.948

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ChromeModa Solutions

Germany . 3,194 parts In-Stock

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$11.724

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$9.614

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3,194

$11.724

$9.614

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IDEA Electronic Components Group

UK . 69 parts In-Stock

1+ parts

$11.724

100+ parts

$11.138

1k+ parts

$10.552

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69

$11.724

$11.138

$10.552

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AZTECH Wire

Italy . 515 parts In-Stock

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$12.550

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515

$12.550

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Component Stockers USA

USA . 659 parts In-Stock

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$99.990

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659

$99.990

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A-Z Elektronik GmbH

Germany . 14,250 parts In-Stock

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Corphita

USA . 803 parts In-Stock

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Perfect Parts

USA . 679 parts In-Stock

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Corohmni

South Africa . 235 parts In-Stock

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DigiPath Technology Company

USA . 65 parts In-Stock

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$10.570

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65

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$10.570

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Overview

Experience superior performance and reliability with the Texas Instruments TLC551CDG4, a cutting-edge analog waveform generation device. Crafted with precision by Texas Instruments, a renowned industry leader, this product offers unparalleled quality and innovation in the field of analog technology. Ideal for a wide range of applications, the TLC551CDG4 provides customers with exceptional value, efficiency, and versatility. Whether you're looking to enhance your audio equipment, telecommunications systems, or industrial automation, this product is designed to exceed your expectations. Elevate your projects with the TLC551CDG4 and unlock a world of possibilities in analog waveform generation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring long-term reliability.

Maximum Output Frequency: 1.2 GHz

Allows for high-frequency signal generation, making this product suitable for a wide range of applications including telecommunications and test equipment.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage supply requirement that can be easily met with common power sources, simplifying the implementation of this product into existing systems.

Minimum Operating Temperature: 0 °C

Can operate effectively in low-temperature environments, expanding the range of applications where this product can be used.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high noise immunity, making this product efficient and reliable.

Technical Specifications

Analog Waveform Generation TLC551CDG4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TLC551CDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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