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TLC4545IDGKRG4

Texas Instruments

TLC4545IDGKRG4 by Texas Instruments

TLC4545IDGKRG4 by Texas Instruments is a 16-bit ADC with 0.0038% EL, 2.94us conversion time, and 0.2MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C, has a 5V supply voltage, and outputs data in serial format.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,972 parts In-Stock

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3,972

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Vyrian

USA . 3,840 parts In-Stock

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3,840

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 857 parts In-Stock

1+ parts

$11.000

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857

$11.000

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Parana Technologies

USA . 1,160 parts In-Stock

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$11.226

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$11.661

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1,160

$11.226

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$11.661

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DigiPath Technology Company

USA . 75 parts In-Stock

1+ parts

$12.361

100+ parts

$11.372

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75

$12.361

$11.372

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ChromeModa Solutions

Germany . 5,093 parts In-Stock

1+ parts

$12.613

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$10.343

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5,093

$12.613

$10.343

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IDEA Electronic Components Group

UK . 1,442 parts In-Stock

1+ parts

$12.613

100+ parts

$11.982

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$11.352

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1,442

$12.613

$11.982

$11.352

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AZTECH Wire

Italy . 803 parts In-Stock

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$13.112

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803

$13.112

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One Stop Electronics

USA . 1,022 parts In-Stock

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$23.000

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1,022

$23.000

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Corphita

USA . 739 parts In-Stock

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739

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Microchip USA

USA . 269 parts In-Stock

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269

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of precision with the TLC4545IDGKRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are essential for a wide range of applications. With its small outline and thin profile package style, this converter offers unmatched accuracy and reliability. Whether you're in industrial automation, medical equipment, or automotive systems, the TLC4545IDGKRG4 provides fast conversion times and low linearity error, ensuring optimal performance in your designs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components and provides good protection and durability for the converter.

No. of Bits: 16

With 16 bits, this ADC allows for high-resolution conversions, providing accurate results for digital data processing.

Maximum Conversion Time: 2.94 us

The fast conversion time of 2.94 microseconds allows for quick sampling and processing of analog input signals.

Maximum Analog Input Voltage: 5.5 V

The wide input voltage range of up to 5.5 volts accommodates various analog input signals, making it versatile for different applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the converter efficient and reliable for analog-to-digital conversion.

Output Format: SERIAL

The serial output format allows for easy integration with digital systems and communication protocols, enhancing the versatility of the converter.

Technical Specifications

Analog-to-Digital Converters TLC4545IDGKRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.94 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

Trade Compliance

TLC4545IDGKRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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