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TLC4541IDR

Texas Instruments

TLC4541IDR by Texas Instruments

TLC4541IDR by Texas Instruments is a 16-bit ADC with 0.0038% EL, 5V supply, and 0.2 MHz sample rate. Ideal for industrial applications, it offers SERIAL output format, 2.94us conversion time, and operates b/w -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,001 parts In-Stock

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6,001

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Digiode

USA . 2,965 parts In-Stock

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Nova Conductors

Japan . 59 parts In-Stock

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59

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Distributors (Availability)

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Corohmni

South Africa . 126 parts In-Stock

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$11.836

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126

$11.836

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AZTECH Wire

Italy . 218 parts In-Stock

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$17.537

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218

$17.537

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Ampacity Inc.

Singapore . 1,215 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 470 parts In-Stock

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$18.798

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$18.886

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470

$18.798

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$18.886

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DigiPath Technology Company

USA . 2,320 parts In-Stock

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$20.699

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$20.699

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ChromeModa Solutions

Germany . 5,850 parts In-Stock

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$21.121

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$17.319

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$21.121

$17.319

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IDEA Electronic Components Group

UK . 1,915 parts In-Stock

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$21.121

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$20.065

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$19.009

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1,915

$21.121

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$19.009

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One Stop Electronics

USA . 711 parts In-Stock

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$26.000

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711

$26.000

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QUARKTWIN TECHNOLOGY LTD

USA . 11,365 parts In-Stock

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Argo Parts USA

USA . 3,420 parts In-Stock

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Corphita

USA . 2,877 parts In-Stock

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Continental Prestige Electronics

USA . 784 parts In-Stock

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784

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Microchip USA

USA . 332 parts In-Stock

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332

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Bastille Electronics

Australia . 83 parts In-Stock

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Overview

Experience superior analog-to-digital conversion with the TLC4541IDR by Texas Instruments. Crafted with precision and expertise, this high-quality ADC offers unparalleled performance and reliability for a wide range of applications. From industrial automation to medical devices, the TLC4541IDR delivers accurate results with minimal linearity error. Its compact design and advanced technology make it an ideal choice for demanding projects where speed and efficiency are key. Trust Texas Instruments to provide you with cutting-edge solutions that elevate your designs to the next level. Choose the TLC4541IDR and experience the difference in quality and performance today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product suitable for various applications.

No. of Bits: 16

Provides high resolution for accurate conversions, suitable for precision measurement applications.

Maximum Linearity Error (EL): 0.0038 %

Offers high accuracy in conversion, ensuring reliable results.

Power Supplies (V): 5

Common voltage supply that is easy to work with and readily available.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Sample Rate: 0.2 MHz

High sample rate allows for quick and continuous conversions, ideal for fast-changing signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC offers a good balance between speed and accuracy, suitable for a wide range of applications.

Technical Specifications

Analog-to-Digital Converters TLC4541IDR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.94 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP8,.25

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

Trade Compliance

TLC4541IDR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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