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TLC374CDG4

Texas Instruments

TLC374CDG4 by Texas Instruments

TLC374CDG4 by Texas Instruments is a CMOS comparator with 4 functions, Vsup of 5V, and IIB of 0.0006uA. It has a response time of 650ns and operates b/w 0-70°C. Ideal for applications requiring open-collector output in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,108 parts In-Stock

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Digiode

USA . 1,338 parts In-Stock

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Parana Technologies

USA . 1,628 parts In-Stock

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$1.457

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$2.143

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$1.457

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DigiPath Technology Company

USA . 1,731 parts In-Stock

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$1.604

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$1.476

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ChromeModa Solutions

Germany . 5,588 parts In-Stock

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$1.637

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$1.342

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IDEA Electronic Components Group

UK . 2,376 parts In-Stock

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$1.637

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$1.473

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Ampacity Inc.

Singapore . 1,354 parts In-Stock

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$3.410

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AZTECH Wire

Italy . 431 parts In-Stock

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$6.259

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One Stop Electronics

USA . 223 parts In-Stock

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$7.410

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Corphita

USA . 2,606 parts In-Stock

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Perfect Parts

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Overview

Discover the Texas Instruments TLC374CDG4, a top-quality comparator that offers unmatched precision and reliability. Manufactured by industry leader Texas Instruments, this product boasts a wide range of applications in various fields. With its advanced technology and compact design, the TLC374CDG4 provides customers with outstanding performance and value. Whether you're working on automotive systems, industrial controls, or consumer electronics, this versatile comparator is sure to meet your needs. Upgrade your projects today with the TLC374CDG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and mechanical protection, making the product durable and reliable.

Maximum Input Offset Voltage: 6500 uV

High input offset voltage allows for precise measurement and comparison of input signals.

Maximum Average Bias Current (IIB): 0.0006 uA

Low average bias current ensures minimal power consumption and accurate operation.

Surface Mount: YES

Surface mount capability makes installation and integration of the comparator easier and more flexible.

No. of Functions: 4

Having multiple functions in one device saves space and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, the comparator can be used in a variety of environments without overheating.

Output Type: OPEN-COLLECTOR

Open-collector output allows for easy interfacing with other components and devices.

Technology: CMOS

CMOS technology ensures low power consumption and fast response times.

Amplifier Type: COMPARATOR

Being specifically designed as a comparator ensures accurate and reliable comparison of input signals.

Technical Specifications

Comparators TLC374CDG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

600 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

650 ns

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC374CDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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