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TLC372IDRG4

Texas Instruments

TLC372IDRG4 by Texas Instruments

TLC372IDRG4 by Texas Instruments is a dual comparator with 7000uV max input offset voltage and 0.002uA max average bias current. It operates at -40 to 85 °C, ideal for industrial applications requiring fast response time of 650ns. The small outline package with gull wing terminals makes it suitable for surface mount designs in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 62,710 parts In-Stock

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Vyrian

USA . 8,384 parts In-Stock

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8,384

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Pegasus Components GmbH

Germany . 1,576 parts In-Stock

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1,576

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Digiode

USA . 828 parts In-Stock

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828

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Nova Conductors

Japan . 47 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 925 parts In-Stock

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$1.000

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925

$1.000

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Parana Technologies

USA . 1,115 parts In-Stock

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$2.234

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$2.737

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$2.234

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$2.737

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DigiPath Technology Company

USA . 1,984 parts In-Stock

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$2.460

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$2.460

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ChromeModa Solutions

Germany . 2,048 parts In-Stock

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$2.510

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$2.058

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$2.510

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IDEA Electronic Components Group

UK . 14 parts In-Stock

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$2.510

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$2.259

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14

$2.510

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Ampacity Inc.

Singapore . 510 parts In-Stock

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$4.410

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510

$4.410

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One Stop Electronics

USA . 399 parts In-Stock

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$7.410

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399

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AZTECH Wire

Italy . 819 parts In-Stock

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$10.768

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Continental Prestige Electronics

USA . 6,916 parts In-Stock

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Argo Parts USA

USA . 3,356 parts In-Stock

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Microchip USA

USA . 1,252 parts In-Stock

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Corphita

USA . 921 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your electronic designs with the TLC372IDRG4 by Texas Instruments, a high-quality comparator that offers unmatched precision and reliability. Manufactured by industry leader Texas Instruments, this device is ideal for a wide range of applications where speed and accuracy are essential. With a compact design and low power consumption, the TLC372IDRG4 provides exceptional value and performance for your projects. Upgrade your circuits today with this top-of-the-line comparator from Texas Instruments and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, making this product a reliable choice for various applications.

Maximum Input Offset Voltage: 7000 uV

The low maximum input offset voltage ensures accurate and precise measurements, making this comparator suitable for sensitive electronic systems.

Maximum Average Bias Current (IIB): 0.002 uA

With a low maximum average bias current, this comparator helps to minimize power consumption and ensures efficient operation in power-sensitive applications.

Surface Mount: YES

The surface mount compatibility of this comparator allows for easy and space-saving integration onto circuit boards, making it a convenient option for compact designs.

No. of Functions: 2

The inclusion of two functions in one device offers versatility and flexibility in circuit design, making this comparator a versatile choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape provides easy handling and installation, making this comparator user-friendly and suitable for different mounting configurations.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making this comparator a practical choice for a wide range of applications.

Power Supplies (V): 5

The compatibility with 5V power supplies ensures seamless integration and operation in standard electronic systems, making this comparator a convenient choice for many projects.

No. of Terminals: 8

With eight terminals, this comparator offers ample connectivity options, enabling versatile circuit configurations and making it suitable for complex systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for efficient use of PCB real estate, making this comparator ideal for compact designs.

Technical Specifications

Comparators TLC372IDRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

300 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

650 ns

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC372IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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