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TLC2202ACDRG4

Texas Instruments

TLC2202ACDRG4 by Texas Instruments

TLC2202ACDRG4 by Texas Instruments is a dual operational amplifier with low-offset and low-bias features. It operates at a max supply voltage of 8V, offers micropower consumption, and has a nominal unity gain bandwidth of 1900 kHz. Ideal for applications requiring precise signal amplification in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,012 parts In-Stock

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4,012

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Vyrian

USA . 3,989 parts In-Stock

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3,989

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Distributors (Availability)

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Parana Technologies

USA . 680 parts In-Stock

1+ parts

$1.066

100+ parts

-

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$1.920

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680

$1.066

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$1.920

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ChromeModa Solutions

Germany . 5,981 parts In-Stock

1+ parts

$1.198

100+ parts

$0.982

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5,981

$1.198

$0.982

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IDEA Electronic Components Group

UK . 2,065 parts In-Stock

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$1.198

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$1.078

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2,065

$1.198

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$1.078

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One Stop Electronics

USA . 1,342 parts In-Stock

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$7.410

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1,342

$7.410

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AZTECH Wire

Italy . 519 parts In-Stock

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$12.671

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519

$12.671

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Microchip USA

USA . 11,907 parts In-Stock

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11,907

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Corphita

USA . 3,719 parts In-Stock

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DigiPath Technology Company

USA . 2,059 parts In-Stock

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$1.080

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2,059

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$1.080

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Overview

Enhance your electronic design projects with the TLC2202ACDRG4 operational amplifiers from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for applications requiring precision and low power consumption, these op amps offer exceptional performance with high voltage gain and low bias current. Trust Texas Instruments to provide you with the tools you need to take your designs to the next level. Elevate your projects with the TLC2202ACDRG4 and experience the difference that top-notch components can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the op amp, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 650 uV

Low input offset voltage ensures accurate signal processing and reduces errors in the output signal.

Surface Mount: YES

Surface mount capability enables easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage ensures consistent performance and reliable operation of the op amp.

Frequency Compensation: YES

Frequency compensation improves stability and performance of the op amp over a wide range of frequencies.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the op amp suitable for battery-operated devices and high-frequency applications.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2202ACDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.3/±8/4.6/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

75 dB

Input Offset Voltage Limit:

650 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

1.3 V/us

Nominal Slew Rate:

2.5 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

2.7 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2202ACDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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