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TLC14N3

Texas Instruments

TLC14N3 by Texas Instruments

TLC14N3 by Texas Instruments is a CMOS active filter with 8 terminals and ±2.5/±5V power supplies. It features a switched capacitor filter with Butterworth transfer characteristics, ideal for lowpass filtering applications. With a temperature range of 0-70°C, it is suitable for commercial-grade electronic systems requiring precise signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,935 parts In-Stock

1+ parts

-

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5,935

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Digiode

USA . 4,670 parts In-Stock

1+ parts

-

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-

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4,670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 262 parts In-Stock

1+ parts

$1.690

100+ parts

-

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262

$1.690

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Parana Technologies

USA . 1,135 parts In-Stock

1+ parts

$7.387

100+ parts

-

1k+ parts

$7.878

10k+ parts

-

1,135

$7.387

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$7.878

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DigiPath Technology Company

USA . 28 parts In-Stock

1+ parts

$8.134

100+ parts

$7.483

1k+ parts

-

10k+ parts

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28

$8.134

$7.483

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ChromeModa Solutions

Germany . 2,177 parts In-Stock

1+ parts

$8.300

100+ parts

$6.806

1k+ parts

-

10k+ parts

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2,177

$8.300

$6.806

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IDEA Electronic Components Group

UK . 339 parts In-Stock

1+ parts

$8.300

100+ parts

$7.885

1k+ parts

$7.470

10k+ parts

-

339

$8.300

$7.885

$7.470

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AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$14.980

100+ parts

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707

$14.980

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Corphita

USA . 1,756 parts In-Stock

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1,756

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Overview

Unlock the power of precise signal processing with the TLC14N3 by Texas Instruments. As a leading manufacturer in active filters, Texas Instruments delivers top-quality products that meet the highest industry standards. The TLC14N3 offers customers unmatched value and benefits, providing reliable performance for a wide range of applications. From audio equipment to medical devices, this switched capacitor filter delivers exceptional results with its advanced technology and superior design. Experience the difference with the TLC14N3 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the component, ensuring a longer lifespan.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the active filter more energy-efficient and reliable.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit designs and efficient use of space on a PCB.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, reducing the risk of disconnection in high-vibration environments.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters offer high precision and versatility in filtering applications, allowing for customizable frequency responses.

Power Supplies (V): +-2.5/+-5

Multiple power supply options provide flexibility in different voltage environments, making this active filter suitable for various applications.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and complex circuit configurations, enhancing the filter's overall performance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures stable performance even in challenging thermal conditions.

Transfer Characteristics: BUTTERWORTH

Butterworth transfer characteristics offer a maximally flat frequency response, making this active filter ideal for applications requiring precise signal output.

Technical Specifications

Active Filters TLC14N3 attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Power Supply:

±2.5/±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Butterworth

Filter Order:

4th

Environmental Characteristics

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

8

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T8

Trade Compliance

TLC14N3 Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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