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TLC04MP

Texas Instruments

TLC04MP by Texas Instruments

TLC04MP by Texas Instruments is an active filter with 4 poles and 0 zeros, operating at a temperature range of -55 to 125 °C. It has a lowpass response type with Butterworth transfer characteristics and a max cutoff frequency of 40 kHz. Ideal for military applications due to its MIL-graded temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,332 parts In-Stock

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5,332

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Digiode

USA . 670 parts In-Stock

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670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,605 parts In-Stock

1+ parts

$2.690

100+ parts

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1,605

$2.690

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AZTECH Wire

Italy . 705 parts In-Stock

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$11.505

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705

$11.505

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Parana Technologies

USA . 972 parts In-Stock

1+ parts

$17.979

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$18.141

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972

$17.979

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$18.141

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DigiPath Technology Company

USA . 185 parts In-Stock

1+ parts

$19.797

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$18.213

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185

$19.797

$18.213

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IDEA Electronic Components Group

UK . 2,037 parts In-Stock

1+ parts

$20.201

100+ parts

$19.191

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$18.181

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2,037

$20.201

$19.191

$18.181

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ChromeModa Solutions

Germany . 1,147 parts In-Stock

1+ parts

$20.201

100+ parts

$16.565

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1,147

$20.201

$16.565

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Corphita

USA . 4,287 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TLC04MP Active Filter. This versatile component offers a wide range of applications, from audio processing to signal conditioning. With its advanced CMOS technology and low power consumption, the TLC04MP provides exceptional performance while maintaining efficiency. Upgrade your projects with this innovative switched capacitor filter that delivers precise and accurate results every time. Trust in Texas Instruments to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures long-lasting performance and protection for the internal components.

Maximum Supply Current (Isup): 3 mA

Low power consumption for efficient operation and reduced energy costs.

Technology: CMOS

CMOS technology provides high-speed operation and low power consumption.

Package Shape: RECTANGULAR

Compact design allows for easy integration into existing systems or circuit boards.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components or devices.

Active Filter Type: SWITCHED CAPACITOR FILTER

Switched capacitor filters offer precise frequency response and filtering capabilities.

Response Type: LOWPASS

Lowpass filter design ensures only lower frequencies pass through, ideal for certain signal processing applications.

Transfer Characteristics: BUTTERWORTH

Butterworth filter design provides maximally flat passband response and excellent roll-off characteristics.

Max Center/Cutoff Freq Rng: 40 kHz

Wide range of cutoff frequencies allows for versatile filtering options based on application requirements.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in harsh environmental conditions.

Technical Specifications

Active Filters TLC04MP attributes and parameters. Explore more Active Filters devices from Texas Instruments

Electrical Characteristics

Supply Voltage Limit:

6 V

Minimum Supply Voltage (Vsup):

2.25 V

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

3 mA

Maximum Negative Supply Voltage:

-6 V

Minimum Negative Supply Voltage:

-2.25 V

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±2.5/±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Maximum Frequency - Cutoff or Center:

40 kHz

Minimum Frequency - Cutoff or Center:

0.1 Hz

Transfer Characteristics:

Butterworth

Poles and Zeros:

4 and 0

Filter Order:

4th

Environmental Characteristics

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

8

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Length:

0.386 in (9.81 mm)

Width:

0.3 in (7.62 mm)

Seated Height Limit:

0.2 in (5.08 mm)

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T8

Additional Features

Qualified:

No

Trade Compliance

TLC04MP Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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