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TL4050B41IDBZRG4

Texas Instruments

TL4050B41IDBZRG4 by Texas Instruments

TL4050B41IDBZRG4 by Texas Instruments is a 3-terminal voltage reference with output voltage of 4.096V, tolerance of 0.2%, and temp coef of 50 ppm/°C. Ideal for industrial applications requiring precise voltage regulation in compact spaces due to its small outline, thin profile package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,514 parts In-Stock

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8,514

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Chip Stock

USA . 5,000 parts In-Stock

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5,000

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Digiode

USA . 1,788 parts In-Stock

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1,788

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Distributors (Availability)

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Semicontronic

India . 373 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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373

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 630 parts In-Stock

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$1.500

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630

$1.500

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Ampacity Inc.

Singapore . 1,137 parts In-Stock

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$5.500

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1,137

$5.500

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Parana Technologies

USA . 1,325 parts In-Stock

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$8.667

100+ parts

$804.846

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$7.800

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1,325

$8.667

$804.846

$7.800

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DigiPath Technology Company

USA . 995 parts In-Stock

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$9.543

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995

$9.543

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ChromeModa Solutions

Germany . 4,769 parts In-Stock

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$9.738

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$7.985

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4,769

$9.738

$7.985

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IDEA Electronic Components Group

UK . 698 parts In-Stock

1+ parts

$9.738

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$9.251

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$8.764

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698

$9.738

$9.251

$8.764

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AZTECH Wire

Italy . 654 parts In-Stock

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$11.766

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654

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Component Stockers USA

USA . 562 parts In-Stock

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$99.990

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562

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Microchip USA

USA . 2,548 parts In-Stock

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Corphita

USA . 1,268 parts In-Stock

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iodParts Technologies Inc.

India . 234 parts In-Stock

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$2.212

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$2.212

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Corohmni

South Africa . 158 parts In-Stock

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158

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Overview

Discover the Texas Instruments TL4050B41IDBZRG4, a top-quality voltage reference that stands out for its reliability and precision. Manufactured by industry leader Texas Instruments, this small outline, thin profile component is perfect for a wide range of applications. With a nominal output voltage of 4.096V and a maximum voltage tolerance of 0.2%, this dual-terminal reference offers unmatched accuracy. Trust Texas Instruments for exceptional performance and dependability in your voltage reference needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and resistance to external elements, making it suitable for a wide range of applications

Surface Mount: YES

Allows for easy and efficient installation on circuit boards

Minimum Output Voltage: 4.0878 V

Ensures a stable and reliable output voltage for precise performance

Maximum Operating Temperature: 85 °C

Can operate efficiently in high temperature environments without performance degradation

Technology: BIPOLAR

Utilizes bipolar technology for accurate and low noise voltage reference output

Technical Specifications

Voltage References TL4050B41IDBZRG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

4.1041 V

Minimum Output Voltage:

4.0878 V

Nominal Output Voltage:

4.096 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

50 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.2 %

Width (mm):

1.3 mm

Trade Compliance

TL4050B41IDBZRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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