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TL4050A10IDBZTG4

Texas Instruments

TL4050A10IDBZTG4 by Texas Instruments

TL4050A10IDBZTG4 by Texas Instruments is a 3-terminal voltage reference with output voltage of 10V, temp coef of 50 ppm/°C, and max tolerance of 0.1%. Ideal for industrial applications requiring precise voltage regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,949 parts In-Stock

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4,949

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Digiode

USA . 2,951 parts In-Stock

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2,951

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 559 parts In-Stock

1+ parts

$3.500

100+ parts

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559

$3.500

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One Stop Electronics

USA . 1,263 parts In-Stock

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$4.500

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1,263

$4.500

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Parana Technologies

USA . 582 parts In-Stock

1+ parts

$6.589

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$7.329

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582

$6.589

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$7.329

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ChromeModa Solutions

Germany . 3,704 parts In-Stock

1+ parts

$7.403

100+ parts

$6.070

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3,704

$7.403

$6.070

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IDEA Electronic Components Group

UK . 319 parts In-Stock

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$7.403

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$6.663

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319

$7.403

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$6.663

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Semicontronic

India . 983 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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983

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 629 parts In-Stock

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$15.372

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629

$15.372

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Corphita

USA . 1,198 parts In-Stock

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DigiPath Technology Company

USA . 1,137 parts In-Stock

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$6.675

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$6.675

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Corohmni

South Africa . 201 parts In-Stock

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Overview

Dive into a world of precision and reliability with the TL4050A10IDBZTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality voltage references that are perfect for a wide range of applications. With its small outline and thin profile design, this product offers maximum performance in a compact package. Experience peace of mind knowing that you can rely on this voltage reference for accurate and stable output voltages. Upgrade your projects with the TL4050A10IDBZTG4 and unlock a whole new level of efficiency and effectiveness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and placement on a PCB, optimizing space usage.

No. of Terminals: 3

With 3 terminals, this voltage reference offers flexibility in circuit connections and configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various operating conditions.

Minimum Output Voltage: 9.99 V

Stable minimum output voltage ensures consistent and accurate reference voltage for precise circuit operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function effectively in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Maximum Output Voltage: 10.01 V

High maximum output voltage ensures a wide output range for diverse applications and voltage reference needs.

Maximum Seated Height: 1.12 mm

Low seated height allows for compact and space-efficient design, ideal for applications with size constraints.

Width (mm): 1.3 mm

Narrow width facilitates easy integration and placement on PCBs with limited space, optimizing board layout.

Other IC type: TWO TERMINAL VOLTAGE REFERENCE

Two-terminal voltage reference design simplifies circuit connections and offers straightforward operation and integration.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during production, enhancing product durability and performance.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating allows the product to withstand harsh environmental conditions and industrial applications.

Technology: BIPOLAR

Bipolar technology offers stable and accurate voltage reference output, essential for precise circuit operation and performance.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring stable electrical contact in various operating conditions.

Maximum Voltage Tolerance: 0.1 %

Low maximum voltage tolerance ensures accurate and precise voltage reference output, crucial for applications requiring high accuracy.

Maximum Voltage Temp Coef: 50 ppm/°C

Low maximum voltage temperature coefficient ensures minimal voltage variation with temperature changes, maintaining consistent performance.

Nominal Output Voltage: 10 V

Stable nominal output voltage of 10 V provides a reliable and consistent reference voltage for accurate circuit operation.

Technical Specifications

Voltage References TL4050A10IDBZTG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

10.01 V

Minimum Output Voltage:

9.99 V

Nominal Output Voltage:

10 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

50 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.1 %

Width (mm):

1.3 mm

Trade Compliance

TL4050A10IDBZTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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