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TL35071ADR

Texas Instruments

TL35071ADR by Texas Instruments

TL35071ADR by Texas Instruments is an Operational Amplifier with 5000uV Max Input Offset Voltage, -1.8uA Max Average Bias Current, and 97dB Nominal CMRR. Ideal for military applications due to its MIL-TEMP rating and VOLTAGE-FEEDBACK architecture.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,427 parts In-Stock

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Vyrian

USA . 1,942 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

$4.512

100+ parts

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$4.957

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775

$4.512

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$4.957

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DigiPath Technology Company

USA . 1,886 parts In-Stock

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$4.969

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$4.969

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IDEA Electronic Components Group

UK . 1,969 parts In-Stock

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$5.070

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$4.563

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$5.070

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$4.563

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ChromeModa Solutions

Germany . 1,495 parts In-Stock

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$5.070

100+ parts

$4.157

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$5.070

$4.157

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One Stop Electronics

USA . 559 parts In-Stock

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$5.410

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559

$5.410

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AZTECH Wire

Italy . 471 parts In-Stock

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$16.490

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471

$16.490

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A-Z Elektronik GmbH

Germany . 13,341 parts In-Stock

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Corphita

USA . 3,229 parts In-Stock

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Overview

Elevate your circuit designs with the TL35071ADR from Texas Instruments, a leading manufacturer in operational amplifiers. Ideal for a wide range of applications, this high-quality op amp offers unparalleled performance and reliability. With a compact package style and a wide temperature range, this amplifier is perfect for military-grade projects. Trust in Texas Instruments to deliver innovative solutions that exceed expectations. Choose the TL35071ADR for superior quality, value, and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Input Offset Voltage: 5000 uV

Low input offset voltage helps in minimizing errors and improving accuracy in signal processing applications.

Nominal Common Mode Reject Ratio: 97 dB

High common mode rejection ratio indicates the ability of the op amp to reject common mode noise, ensuring a clean output signal.

Nominal Supply Voltage / Vsup (V): 15

Suitable supply voltage for various applications, providing flexibility in design and operation.

Minimum Slew Rate: 8 V/us

Fast slew rate allows for quick response to input signal changes, making the op amp suitable for dynamic applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the op amp to be used in extreme environmental conditions without performance degradation.

Nominal Unity Gain Bandwidth: 4500 kHz

High unity gain bandwidth indicates the op amp's capability to handle high frequency signals accurately.

Technology: BIPOLAR

Bipolar technology offers high precision and low noise performance, making the op amp suitable for sensitive applications.

Technical Specifications

Operational Amplifiers (Op Amps) TL35071ADR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

97 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

10 V/us

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

4.7 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL35071ADR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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