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TL35071AD

Texas Instruments

TL35071AD by Texas Instruments

TL35071AD by Texas Instruments is an Operational Amplifier with 5000uV Max Input Offset Voltage, 97dB Nominal CMRR, and 4500kHz Unity Gain Bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and VOLTAGE-FEEDBACK architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,702 parts In-Stock

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3,702

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Digiode

USA . 1,132 parts In-Stock

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1,132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,329 parts In-Stock

1+ parts

$1.247

100+ parts

-

1k+ parts

$2.021

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2,329

$1.247

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$2.021

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DigiPath Technology Company

USA . 1,651 parts In-Stock

1+ parts

$1.373

100+ parts

$1.263

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1,651

$1.373

$1.263

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ChromeModa Solutions

Germany . 4,246 parts In-Stock

1+ parts

$1.401

100+ parts

$1.149

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4,246

$1.401

$1.149

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

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$1.401

100+ parts

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$1.261

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2,187

$1.401

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$1.261

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One Stop Electronics

USA . 989 parts In-Stock

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$4.410

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989

$4.410

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AZTECH Wire

Italy . 814 parts In-Stock

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$9.405

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814

$9.405

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Corphita

USA . 3,532 parts In-Stock

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Overview

Experience the power of precision with the TL35071AD operational amplifier by Texas Instruments. Crafted with quality materials and cutting-edge technology, this op amp offers exceptional performance in a compact package. Ideal for a wide range of applications, this amplifier delivers reliable and efficient operation. Whether you're designing audio equipment, control systems, or instrumentation, the TL35071AD provides unmatched versatility and value. Elevate your projects with the superior quality and reliability of Texas Instruments op amps.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 5000 uV

The low input offset voltage ensures accurate signal processing and minimizes errors in the output.

Nominal Supply Voltage / Vsup (V): 15

The nominal supply voltage of 15V provides sufficient power for the operational amplifier to operate effectively.

Minimum Slew Rate: 8 V/us

The minimum slew rate of 8 V/us allows for fast response time and efficient signal amplification.

Nominal Unity Gain Bandwidth: 4500 kHz

The high unity gain bandwidth of 4500 kHz allows for amplification of a wide range of frequencies with minimal distortion.

Technology: BIPOLAR

The bipolar technology used in this operational amplifier offers high precision and low noise, making it suitable for sensitive applications.

Maximum Supply Current: 4.7 mA

The low maximum supply current ensures efficient power consumption, making this operational amplifier energy-efficient.

Technical Specifications

Operational Amplifiers (Op Amps) TL35071AD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

97 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

10 V/us

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

4.7 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL35071AD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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