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TL044MJ/883B

Texas Instruments

TL044MJ/883B by Texas Instruments

TL044MJ/883B by Texas Instruments is a MIL-STD-883 Class B operational amplifier with 4 functions. It operates at temperatures from -55 to 125°C, featuring voltage-feedback architecture and micropower technology. Ideal for military applications due to its ceramic package and bipolar technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,956 parts In-Stock

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8,956

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Digiode

USA . 2,577 parts In-Stock

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2,577

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 223 parts In-Stock

1+ parts

$0.410

100+ parts

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223

$0.410

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Parana Technologies

USA . 1,551 parts In-Stock

1+ parts

$2.570

100+ parts

-

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$3.061

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1,551

$2.570

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$3.061

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DigiPath Technology Company

USA . 758 parts In-Stock

1+ parts

$2.830

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$2.604

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758

$2.830

$2.604

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IDEA Electronic Components Group

UK . 1,665 parts In-Stock

1+ parts

$2.888

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$2.599

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1,665

$2.888

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$2.599

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ChromeModa Solutions

Germany . 1,580 parts In-Stock

1+ parts

$2.888

100+ parts

$2.368

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1,580

$2.888

$2.368

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AZTECH Wire

Italy . 710 parts In-Stock

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$8.339

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710

$8.339

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Corphita

USA . 1,860 parts In-Stock

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1,860

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Overview

Experience top-notch quality and performance with the TL044MJ/883B by Texas Instruments, a leading manufacturer in the industry. This operational amplifier offers unparalleled reliability and precision for various applications in the military sector, ensuring optimal functionality even in extreme conditions. With four functions packed into one robust package, this product delivers exceptional value and efficiency to customers seeking high-quality components that won't disappoint. Trust Texas Instruments to provide you with the best in operational amplifiers for your critical projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides better temperature stability and durability, making it suitable for harsh environments.

No. of Functions: 4

Having 4 functions in one package can save space and reduce component count in circuit design, leading to cost-effectiveness.

Screening Level: MIL-STD-883 Class B (Modified)

MIL-STD-883 Class B screening ensures high reliability and quality standards, making this op amp suitable for critical applications.

Nominal Supply Voltage / Vsup (V): 15

Operates at a nominal supply voltage of 15V, providing a stable power source for consistent performance.

Frequency Compensation: YES

Frequency compensation helps improve stability and bandwidth of the operational amplifier, leading to better overall performance.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold temperatures down to -55°C, suitable for applications in harsh or outdoor environments.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is versatile and widely used in various analog circuits for signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TL044MJ/883B attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

16

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883 Class B (Modified)

Standards

JESD-30 Code:

R-XDIP-T16

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP16,.3

Trade Compliance

TL044MJ/883B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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