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TL044MFH/883B

Texas Instruments

TL044MFH/883B by Texas Instruments

TL044MFH/883B by Texas Instruments is a MILITARY-grade OPERATIONAL AMPLIFIER with 4 functions, VOLTAGE-FEEDBACK architecture, and BIPOLAR technology. It operates b/w -55 to 125 °C, with +-15V power supplies and 15V nominal voltage. Ideal for applications requiring micropower amplification in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,552 parts In-Stock

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6,552

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Digiode

USA . 816 parts In-Stock

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816

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 991 parts In-Stock

1+ parts

$0.410

100+ parts

-

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991

$0.410

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Parana Technologies

USA . 2,267 parts In-Stock

1+ parts

$5.194

100+ parts

-

1k+ parts

$5.802

10k+ parts

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2,267

$5.194

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$5.802

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ChromeModa Solutions

Germany . 1,878 parts In-Stock

1+ parts

$5.836

100+ parts

$4.786

1k+ parts

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1,878

$5.836

$4.786

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IDEA Electronic Components Group

UK . 349 parts In-Stock

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$5.836

100+ parts

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$5.252

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349

$5.836

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$5.252

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AZTECH Wire

Italy . 253 parts In-Stock

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$12.384

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253

$12.384

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Corphita

USA . 3,513 parts In-Stock

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3,513

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DigiPath Technology Company

USA . 473 parts In-Stock

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$5.262

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473

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$5.262

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Overview

Experience unparalleled precision and reliability with the TL044MFH/883B by Texas Instruments, a top-tier manufacturer known for innovative solutions in the field of Operational Amplifiers. This chip carrier package, made of high-quality ceramic material, offers four functions in one, making it ideal for military-grade applications where performance is key. With micropower technology and a wide temperature range, this voltage-feedback amplifier ensures optimal functionality even in the most demanding environments. Trust Texas Instruments for cutting-edge solutions that deliver exceptional value and performance every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides high durability and reliability, making it suitable for operating in harsh environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving time and reducing production costs.

No. of Functions: 4

Having 4 functions in one package increases integration and saves board space, which is beneficial for compact designs.

Screening Level: MIL-STD-883 Class B (Modified)

Military standard screening ensures high quality and reliability, making it suitable for critical applications where performance is crucial.

Nominal Supply Voltage / Vsup (V): 15

Operating at a nominal supply voltage of 15V allows for compatibility with a wide range of systems and applications.

Power Supplies (V): +-15

Dual power supply capability with +-15V provides flexibility in voltage requirements and enhances performance in various operational conditions.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and integration with external circuits, enhancing functionality.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and efficient heat dissipation, making it suitable for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and reliability even in demanding operating conditions.

Frequency Compensation: YES

Frequency compensation feature improves stability and reduces oscillations, enhancing overall performance and accuracy.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for reliable operation in extreme cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

Quad-terminal position enables easy integration and connection with external components, simplifying the design and installation process.

Micropower: YES

Micropower design ensures low power consumption, making it ideal for energy-efficient applications and extending battery life.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable operation in harsh environments and critical applications where performance under extreme conditions is essential.

Technology: BIPOLAR

Bipolar technology offers high precision and performance, making it suitable for applications requiring accurate signal amplification and processing.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability and reduces the risk of solder joint failures, ensuring long-term functionality and durability.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier design provides high gain, accuracy, and stability, making it suitable for a wide range of signal processing and control applications.

Nominal Negative Supply Voltage (Vsup): -15 V

Having a nominal negative supply voltage of -15V ensures compatibility with dual power supply systems and enhances operational flexibility.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers high bandwidth, stability, and linearity, making it suitable for applications requiring precise signal amplification and control.

Terminal Pitch: 1.27 mm

Having a terminal pitch of 1.27mm allows for easy PCB integration and compatibility with standard mounting configurations, simplifying design and assembly processes.

Technical Specifications

Operational Amplifiers (Op Amps) TL044MFH/883B attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-15 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

MIL-STD-883 Class B (Modified)

Standards

JESD-30 Code:

S-XQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TL044MFH/883B Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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