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TISP7145H3SL

Texas Instruments

TISP7145H3SL by Texas Instruments

TISP7145H3SL by Texas Instruments is a silicon surge protector with 60A non-repetitive peak on-state current. It features a thyristor surge protector trigger device and can operate b/w -40°C to 150°C. Ideal for applications requiring protection against voltage surges in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,641 parts In-Stock

1+ parts

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9,641

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Digiode

USA . 1,658 parts In-Stock

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1,658

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 130 parts In-Stock

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130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,112 parts In-Stock

1+ parts

$3.062

100+ parts

$284.316

1k+ parts

$2.755

10k+ parts

-

2,112

$3.062

$284.316

$2.755

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DigiPath Technology Company

USA . 2,170 parts In-Stock

1+ parts

$3.371

100+ parts

$3.102

1k+ parts

-

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2,170

$3.371

$3.102

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ChromeModa Solutions

Germany . 5,218 parts In-Stock

1+ parts

$3.440

100+ parts

$2.821

1k+ parts

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5,218

$3.440

$2.821

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IDEA Electronic Components Group

UK . 682 parts In-Stock

1+ parts

$3.440

100+ parts

-

1k+ parts

$3.096

10k+ parts

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682

$3.440

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$3.096

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AZTECH Wire

Italy . 877 parts In-Stock

1+ parts

$12.078

100+ parts

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877

$12.078

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One Stop Electronics

USA . 1,322 parts In-Stock

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$14.100

100+ parts

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1,322

$14.100

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Corphita

USA . 4,421 parts In-Stock

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4,421

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Overview

Upgrade your electronics with the TISP7145H3SL by Texas Instruments, a top-quality Silicon Surge Protector that offers unparalleled protection against power surges and spikes. Manufactured by industry leader Texas Instruments, this product guarantees reliability and durability. Ideal for a wide range of applications, this surge protector is a valuable investment that ensures the safety and longevity of your devices. Say goodbye to worries about damaged equipment and hello to peace of mind with the TISP7145H3SL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this surge protector lightweight and durable, ensuring long-term reliability.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements provides efficient protection against surges and ensures stable performance under high stress conditions.

Non Repetitive Peak On-state Current: 60 A

With a high non repetitive peak on-state current capability of 60 A, this surge protector can effectively handle sudden surges of electricity without compromising on safety.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy installation and integration into existing electrical systems, making it a convenient choice for users.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enables secure and stable connection, reducing the risk of disconnection during operation and ensuring continuous protection against surges.

No. of Elements: 3

Having 3 elements provides multiple layers of protection, enhancing the overall efficiency and effectiveness of this surge protector in safeguarding electronic devices.

No. of Terminals: 3

The presence of 3 terminals allows for easy and secure connection, enhancing the overall reliability and stability of the surge protector in protecting connected equipment.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this surge protector can withstand high temperatures and harsh environmental conditions, ensuring continuous protection under extreme circumstances.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as a trigger device ensures quick and reliable response to surges, providing instant protection to connected devices against voltage spikes.

Minimum Operating Temperature: -40 °C

The surge protector can operate efficiently even at temperatures as low as -40°C, making it suitable for use in diverse environmental conditions with varying temperature ranges.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection process, reducing the chances of errors and ensuring a hassle-free setup for users.

Maximum Holding Current: 600 mA

With a maximum holding current of 600 mA, this surge protector can effectively suppress low-level surges without compromising on the overall performance and protection provided.

Maximum Breakdown Voltage: 145 V

The surge protector has a high maximum breakdown voltage of 145 V, ensuring reliable protection against voltage spikes and surges in the electrical system, safeguarding connected devices effectively.

Reference Standard: UL RECOGNIZED

Being UL recognized, this surge protector meets stringent safety standards and regulations, assuring users of its quality, reliability, and performance in protecting electronic devices from electrical surges.

Technical Specifications

Silicon Surge Protectors TISP7145H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

145 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

3

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7145H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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