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TISP4145H3LMR

Texas Instruments

TISP4145H3LMR by Texas Instruments

TISP4145H3LMR by Texas Instruments is a single silicon surge protector with a non-repetitive peak on-state current of 60A. It operates b/w -40°C to 150°C, offering protection up to 120V DC off-state voltage. Ideal for applications requiring reliable overvoltage protection in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,027 parts In-Stock

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Digiode

USA . 1,565 parts In-Stock

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Parana Technologies

USA . 81 parts In-Stock

1+ parts

$2.325

100+ parts

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$2.822

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81

$2.325

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$2.822

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IDEA Electronic Components Group

UK . 1,205 parts In-Stock

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$2.612

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$2.351

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$2.612

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$2.351

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ChromeModa Solutions

Germany . 973 parts In-Stock

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$2.612

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$2.142

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973

$2.612

$2.142

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AZTECH Wire

Italy . 672 parts In-Stock

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$5.688

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672

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Ampacity Inc.

Singapore . 287 parts In-Stock

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$16.100

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287

$16.100

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One Stop Electronics

USA . 1,165 parts In-Stock

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$17.100

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$17.100

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Semicontronic

India . 196 parts In-Stock

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$21.100

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$20.572

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$20.467

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Component Stockers USA

USA . 296 parts In-Stock

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$99.990

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Corphita

USA . 3,804 parts In-Stock

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DigiPath Technology Company

USA . 484 parts In-Stock

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$2.355

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Corohmni

South Africa . 78 parts In-Stock

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Overview

Protect your electronic devices with the TISP4145H3LMR by Texas Instruments, a top-quality silicon surge protector designed to safeguard against power surges and voltage spikes. Manufactured by industry leader, Texas Instruments, this single configuration device offers peace of mind with its high non-repetitive peak on-state current of 60A and maximum breakdown voltage of 145V. Ideal for a variety of applications, this round-shaped surge protector is easy to install with its through-hole terminals. Ensure the longevity and reliability of your equipment with the TISP4145H3LMR - your ultimate defense against electrical disturbances.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protects the internal components from external elements, making it a reliable choice for surge protection.

Configuration: SINGLE

The single configuration simplifies installation and operation of the surge protector, making it user-friendly and easy to set up.

Non Repetitive Peak On-state Current: 60 A

The high peak on-state current capability of 60 A ensures effective protection against surge currents, offering reliable protection for connected devices.

Package Shape: ROUND

The round package shape allows for easy installation in various applications, providing flexibility in placement for optimal surge protection.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure connection to the circuit board, ensuring stable operation and reducing the risk of disconnection during surges.

No. of Terminals: 2

The two terminals offer a simple and straightforward connection setup, making it easy to integrate the surge protector into a circuit for enhanced protection.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for compact and space-saving installation, making it ideal for installations where space is limited.

Maximum DC Off-state Voltage: 120 V

The maximum DC off-state voltage rating of 120 V ensures compatibility with a wide range of DC voltage systems, making it versatile for different applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the surge protector to withstand elevated temperatures, ensuring reliable performance in various environments.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The thyristor surge protector type offers fast response times and reliable protection against surges, safeguarding connected devices from voltage spikes.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the surge protector can function effectively in cold environments, offering reliable protection year-round.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy mounting and connection to the circuit board, ensuring a secure and reliable installation for effective surge protection.

Maximum Holding Current: 600 mA

The high maximum holding current rating of 600 mA allows the surge protector to handle continuous currents without tripping, providing sustained protection for connected devices.

Maximum Breakdown Voltage: 145 V

The maximum breakdown voltage of 145 V ensures reliable protection against voltage surges, offering a safety margin for connected devices in case of a surge event.

Technical Specifications

Silicon Surge Protectors TISP4145H3LMR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

145 V

Configuration:

Maximum DC Off-state Voltage:

120 V

Maximum Holding Current:

600 mA

JESD-30 Code:

O-PBCY-T2

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4145H3LMR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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