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TISP3380F3P

Texas Instruments

TISP3380F3P by Texas Instruments

TISP3380F3P by Texas Instruments is a silicon surge protector with 2 series-connected elements. It offers a non-repetitive peak on-state current of 6A and a max DC off-state voltage of 270V. Ideal for applications requiring protection against surges in electrical circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,189 parts In-Stock

1+ parts

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7,189

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Digiode

USA . 2,694 parts In-Stock

1+ parts

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2,694

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 959 parts In-Stock

1+ parts

$2.361

100+ parts

-

1k+ parts

$2.860

10k+ parts

-

959

$2.361

-

$2.860

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DigiPath Technology Company

USA . 1,472 parts In-Stock

1+ parts

$2.600

100+ parts

$2.392

1k+ parts

-

10k+ parts

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1,472

$2.600

$2.392

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ChromeModa Solutions

Germany . 4,942 parts In-Stock

1+ parts

$2.653

100+ parts

$2.175

1k+ parts

-

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4,942

$2.653

$2.175

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IDEA Electronic Components Group

UK . 2,081 parts In-Stock

1+ parts

$2.653

100+ parts

-

1k+ parts

$2.388

10k+ parts

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2,081

$2.653

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$2.388

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Ampacity Inc.

Singapore . 875 parts In-Stock

1+ parts

$7.100

100+ parts

-

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875

$7.100

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AZTECH Wire

Italy . 226 parts In-Stock

1+ parts

$16.734

100+ parts

-

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226

$16.734

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One Stop Electronics

USA . 1,403 parts In-Stock

1+ parts

$22.100

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1,403

$22.100

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Semicontronic

India . 1,133 parts In-Stock

1+ parts

$26.100

100+ parts

$25.448

1k+ parts

$25.317

10k+ parts

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1,133

$26.100

$25.448

$25.317

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

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442

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Corphita

USA . 159 parts In-Stock

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159

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Overview

Protect your valuable electronic devices with the TISP3380F3P by Texas Instruments, a top-quality silicon surge protector designed to safeguard against voltage spikes and surges. Manufactured by industry leader Texas Instruments, this surge protector offers peace of mind and reliability for a wide range of applications. With its series-connected configuration and high non-repetitive peak on-state current, this product provides superior protection for your equipment. Trust in Texas Instruments for the best in surge protection technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection against external elements and ensures durability.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

Efficiently diverts excess voltage and protects connected devices.

Non Repetitive Peak On-state Current: 6 A

Capable of handling high peak currents, ensuring reliable surge protection.

Package Shape: RECTANGULAR

Compact design allows for easy installation in various applications.

Terminal Form: THROUGH-HOLE

Enables secure and stable connection to circuit boards.

No. of Elements: 2

Dual elements provide additional protection and redundancy.

No. of Terminals: 8

Offers multiple connection options for flexibility in installation.

Package Style (Meter): IN-LINE

Sleek design for seamless integration in electrical systems.

Maximum DC Off-state Voltage: 270 V

Provides sufficient protection against overvoltage situations.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Reliable and fast-acting protection technology for surge events.

Terminal Position: DUAL

Enhances connectivity and overall effectiveness for surge protection.

Maximum Breakdown Voltage: 380 V

Higher breakdown voltage ensures protection for sensitive electronics.

Reference Standard: UL RECOGNIZED

Meets industry standards for safety and performance assurance.

Technical Specifications

Silicon Surge Protectors TISP3380F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

380 V

Maximum DC Off-state Voltage:

270 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3380F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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