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TISP3260F3D

Texas Instruments

TISP3260F3D by Texas Instruments

TISP3260F3D by Texas Instruments is a Silicon Surge Protector with 4A Non Repetitive Peak On-state Current. It features SERIES CONNECTED, CENTER TAP configuration and 200V Max DC Off-state Voltage. Ideal for protecting electronic devices from voltage surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,232 parts In-Stock

1+ parts

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7,232

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Digiode

USA . 793 parts In-Stock

1+ parts

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793

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

$2.094

100+ parts

-

1k+ parts

$2.611

10k+ parts

-

2,108

$2.094

-

$2.611

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DigiPath Technology Company

USA . 1,140 parts In-Stock

1+ parts

$2.306

100+ parts

-

1k+ parts

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1,140

$2.306

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ChromeModa Solutions

Germany . 1,891 parts In-Stock

1+ parts

$2.353

100+ parts

$1.929

1k+ parts

-

10k+ parts

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1,891

$2.353

$1.929

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IDEA Electronic Components Group

UK . 1,375 parts In-Stock

1+ parts

$2.353

100+ parts

-

1k+ parts

$2.118

10k+ parts

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1,375

$2.353

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$2.118

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AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$8.697

100+ parts

-

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545

$8.697

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Ampacity Inc.

Singapore . 871 parts In-Stock

1+ parts

$12.100

100+ parts

-

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871

$12.100

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Semicontronic

India . 548 parts In-Stock

1+ parts

$19.100

100+ parts

$18.622

1k+ parts

$18.527

10k+ parts

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548

$19.100

$18.622

$18.527

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One Stop Electronics

USA . 1,599 parts In-Stock

1+ parts

$24.100

100+ parts

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1,599

$24.100

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Corphita

USA . 1,642 parts In-Stock

1+ parts

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1,642

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Corohmni

South Africa . 462 parts In-Stock

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462

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Overview

Upgrade your electronic devices with the TISP3260F3D Silicon Surge Protector by Texas Instruments. As a trusted manufacturer, Texas Instruments ensures high-quality products that guarantee protection against voltage spikes, ensuring the safety and longevity of your valuable equipment. Ideal for a wide range of applications, this surge protector offers peace of mind by safeguarding your devices from unexpected power surges. Invest in the TISP3260F3D today and experience the benefits of reliable surge protection for your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent protection against environmental factors such as moisture and chemicals, ensuring durability and reliability.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration allows for efficient surge protection and distribution of electrical current, reducing the risk of damage to connected devices.

Non Repetitive Peak On-state Current: 4 A

Capable of handling high current surges, providing effective protection for sensitive electronic equipment.

Surface Mount: YES

Easy to install and saves space, making it suitable for applications where compact size is essential.

Package Shape: RECTANGULAR

Ensures easy integration into existing circuits and systems, simplifying the installation process.

Terminal Form: GULL WING

Facilitates secure connections and soldering, enhancing the overall reliability and performance of the surge protector.

Maximum DC Off-state Voltage: 200 V

Provides effective protection against overvoltage conditions, safeguarding connected devices from potential damage.

Trigger Device Type: SILICON SURGE PROTECTOR

Utilizes advanced silicon technology for fast response to surge events, ensuring swift and reliable protection for electronic equipment.

Maximum Breakdown Voltage: 260 V

Offers a margin of safety above the maximum operating voltage, providing an added layer of protection against voltage spikes and surges.

Reference Standard: UL RECOGNIZED

Complies with industry standards for safety and performance, giving users confidence in the quality and reliability of the surge protector.

Technical Specifications

Silicon Surge Protectors TISP3260F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

260 V

Maximum DC Off-state Voltage:

200 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3260F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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