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TISP2290F3D

Texas Instruments

TISP2290F3D by Texas Instruments

TISP2290F3D by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a non-repetitive peak on-state current of 4A and max breakdown voltage of 290V. Ideal for applications requiring protection against surges in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,803 parts In-Stock

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8,803

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Cyclops Electronics Ltd

UK . 4,225 parts In-Stock

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4,225

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Digiode

USA . 3,746 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 150 parts In-Stock

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150

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Parana Technologies

USA . 644 parts In-Stock

1+ parts

$4.180

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$4.623

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644

$4.180

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$4.623

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

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$4.697

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$4.227

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1,284

$4.697

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$4.227

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ChromeModa Solutions

Germany . 569 parts In-Stock

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$4.697

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$3.852

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569

$4.697

$3.852

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AZTECH Wire

Italy . 872 parts In-Stock

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$11.216

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872

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One Stop Electronics

USA . 292 parts In-Stock

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$18.100

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$18.100

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Kepictronics

USA . 5,350 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,907 parts In-Stock

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Corphita

USA . 3,957 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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DigiPath Technology Company

USA . 1,936 parts In-Stock

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$4.235

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$4.235

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Protect your valuable electronic devices with the TISP2290F3D by Texas Instruments, a top-quality silicon surge protector designed to safeguard against power surges and voltage spikes. Manufactured by industry leader Texas Instruments, this device offers peace of mind and reliability in a variety of applications. With its compact design and advanced technology, the TISP2290F3D provides superior protection for your equipment, ensuring uninterrupted performance. Invest in the best with Texas Instruments and keep your electronics safe from potential damage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the surge protector lightweight and durable, perfect for easy installation and long-term use.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient protection against surges and voltage spikes, offering reliable performance.

Non Repetitive Peak On-state Current: 4 A

With a non-repetitive peak on-state current of 4A, this surge protector can handle high current surges, effectively safeguarding connected devices.

Surface Mount: YES

Being surface mountable, this surge protector is easy to install on circuit boards, saving space and allowing for streamlined device designs.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard component layouts, making integration into existing systems hassle-free.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of soldering during assembly, ensuring reliable electrical contact.

Maximum DC Off-state Voltage: 220 V

With a maximum DC off-state voltage of 220V, this surge protector effectively blocks excess voltage from reaching sensitive electronics, enhancing protection.

Trigger Device Type: SILICON SURGE PROTECTOR

Utilizing a silicon surge protector as the trigger device ensures rapid response to voltage fluctuations, offering quick protection to connected equipment.

Maximum Breakdown Voltage: 290 V

The maximum breakdown voltage of 290V indicates the threshold at which the surge protector activates, effectively diverting harmful voltage spikes away from devices.

Reference Standard: UL RECOGNIZED

Being UL recognized certifies that this surge protector meets stringent safety and performance standards, providing reassurance of quality and reliability.

Technical Specifications

Silicon Surge Protectors TISP2290F3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

290 V

Maximum DC Off-state Voltage:

220 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4 A

No. of Elements:

3

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2290F3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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