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THS770012EVM

Texas Instruments

THS770012EVM by Texas Instruments

THS770012EVM by Texas Instruments is an Op Amp Evaluation Board with 1 channel, 3400V/µs Slew Rate, and 900 MHz -3db Bandwidth. It is used for evaluating the THS770012 Differential Amplifier in applications requiring high-speed signal processing and differential output amplification.

Median Price

$108.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 7 parts In-Stock

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$99.000

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DigiKey

USA . 1 parts In-Stock

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$118.800

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1

$118.800

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Digiode

USA . 3,785 parts In-Stock

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$94.050

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3,785

$94.050

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Vyrian

USA . 7,971 parts In-Stock

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$84.150

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4

$84.150

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Semicontronic

India . 4 parts In-Stock

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$84.150

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$82.046

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$81.626

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4

$84.150

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$81.626

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Corphita

USA . 4,415 parts In-Stock

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$89.100

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4,415

$89.100

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Corohmni

South Africa . 246 parts In-Stock

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$99.000

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Parana Technologies

USA . 1,815 parts In-Stock

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$0.119

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IDEA Electronic Components Group

UK . 1,793 parts In-Stock

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DigiPath Technology Company

USA . 933 parts In-Stock

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ChromeModa Solutions

Germany . 918 parts In-Stock

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Overview

Unlock the full potential of your designs with the THS770012EVM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This development board is perfect for evaluating op amps, offering high performance and versatility. Whether you're working on audio equipment or signal processing applications, this board provides unmatched value and benefits. Experience seamless integration and exceptional performance with the THS770012EVM.

Feature Benefit Bullets

Channels per IC: 1 - Single

Having single channel allows for focused testing and evaluation of the specific amplifier's performance without interference from other channels.

Amplifier Type: Differential

The differential amplifier type allows for better noise rejection and common-mode signal rejection, making it suitable for applications where signal accuracy is crucial.

Output Type: Differential

Differential output provides better signal integrity and noise reduction compared to single-ended outputs, ensuring high-quality signal transmission.

Slew Rate: 3400V/µs

High slew rate allows for fast response time in amplifying signals, making this evaluation board suitable for applications requiring quick signal processing.

-3db Bandwidth: 900 MHz

A wide bandwidth of 900 MHz ensures that the evaluation board can handle high-frequency signals accurately, making it ideal for applications requiring high-speed data processing.

Current - Output / Channel: 80 mA

The high output current capability per channel ensures that the evaluation board can drive loads effectively, making it versatile for various applications.

Voltage - Supply, Single/Dual (±): 4.75V ~ 5.25V

The stable supply voltage range allows for reliable performance of the evaluation board within specified operating conditions, ensuring consistent results in different setups.

Utilized IC / Part: THS770012

The utilization of the THS770012 integrated circuit ensures compatibility and optimized performance of the evaluation board, providing accurate and reliable results during testing and evaluation.

Technical Specifications

Additional Parts THS770012EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31021
THS770012EVM-ND

Channels per IC:

1 - Single

Category:

Development Boards, Kits, Programmers
Evaluation Boards Op Amp Evaluation Boards

Output Type:

Differential

-3db Bandwidth:

900 MHz

Slew Rate:

3400V/µs

Current - Supply (Main IC):

100 mA

Standard Package:

1

Supplied Contents:

Board(s)

Board Type:

Fully Populated

Voltage - Supply, Single/Dual (±):

4.75V ~ 5.25V

Utilized IC / Part:

THS770012

Package:

Box

Amplifier Type:

Differential

Current - Output / Channel:

80 mA

Base Product Number:

THS770012

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

THS770012EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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