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THS6226IRHB

Texas Instruments

THS6226IRHB by Texas Instruments

THS6226IRHB by Texas Instruments is a 32-terminal consumer IC in a square chip carrier package. It operates b/w -40 to 85°C, with Vsup ranging from 10V to 12.5V. Ideal for industrial applications requiring high performance and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Goldney Electronics S.L.

Spain . 2,795 parts In-Stock

1+ parts

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1k+ parts

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2,795

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Vyrian

USA . 2,520 parts In-Stock

1+ parts

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100+ parts

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2,520

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Digiode

USA . 1,716 parts In-Stock

1+ parts

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1,716

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,223 parts In-Stock

1+ parts

$0.817

100+ parts

-

1k+ parts

$1.789

10k+ parts

-

1,223

$0.817

-

$1.789

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DigiPath Technology Company

USA . 1,606 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

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10k+ parts

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1,606

$0.900

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IDEA Electronic Components Group

UK . 1,483 parts In-Stock

1+ parts

$0.918

100+ parts

-

1k+ parts

$0.826

10k+ parts

-

1,483

$0.918

-

$0.826

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ChromeModa Solutions

Germany . 409 parts In-Stock

1+ parts

$0.918

100+ parts

$0.753

1k+ parts

-

10k+ parts

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409

$0.918

$0.753

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One Stop Electronics

USA . 661 parts In-Stock

1+ parts

$2.800

100+ parts

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10k+ parts

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661

$2.800

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AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$9.868

100+ parts

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857

$9.868

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Corphita

USA . 94 parts In-Stock

1+ parts

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94

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Overview

Enhance your consumer electronic designs with the THS6226IRHB by Texas Instruments, a top-quality IC that delivers exceptional performance and reliability. With Texas Instruments' reputation for innovation and excellence in manufacturing, you can trust that this product will meet and exceed your expectations. Ideal for various applications in the consumer electronics industry, this IC offers unmatched value and benefits, providing customers with a competitive edge in their projects. Upgrade your designs today with the THS6226IRHB and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuit, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation and replacement of the IC on circuit boards, making it convenient for assembly processes.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board and provides a uniform layout for easier design implementation.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics, ensuring compatibility and optimal performance in various consumer applications.

No. of Terminals: 32

Sufficient number of terminals for connecting to other components, enabling versatile functionality and connectivity options.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers heat dissipation capabilities, compact size, and compatibility with different types of circuits, enhancing the versatility of the product.

Maximum Operating Temperature: 85 °C

Can operate efficiently at high temperatures, making it suitable for industrial and demanding environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliable performance in various temperature environments.

Terminal Position: QUAD

Quad terminal configuration provides stable connections and minimizes signal interference, enhancing the overall reliability of the product.

Maximum Seated Height: 1 mm

Low profile design allows for compact integration into electronic devices, saving space and enabling sleek product designs.

Width: 5 mm

Compact width dimension enables efficient placement on circuit boards and compatibility with standard spacing requirements.

Minimum Supply Voltage (Vsup): 10 V

Operates at low supply voltage levels, conserving power and ensuring energy efficiency in consumer electronic applications.

Length: 5 mm

Short length dimension facilitates space-saving design layouts and enables versatile placement options on circuit boards.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, ensuring reliable operation in harsh environmental conditions typically encountered in industrial settings.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards, promoting sustainability and reducing environmental impact.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and high-density circuit configurations, enhancing design flexibility and complexity.

Maximum Supply Voltage (Vsup): 12.5 V

Capable of handling higher supply voltages, offering versatility and compatibility with a wide range of power sources and applications.

Technical Specifications

Other Function Consumer ICs THS6226IRHB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 10 TO 15 V SUPPLY

General IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

12.5 V

Minimum Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

THS6226IRHB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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