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THS5671AIDWR

Texas Instruments

THS5671AIDWR by Texas Instruments

THS5671AIDWR by Texas Instruments is a 14-bit D/A converter with max output voltage of 1.25V, linearity error of 0.0427%, and settling time of 0.035us. Ideal for industrial applications requiring precise analog signal generation in temperature range -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,466 parts In-Stock

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8,466

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Digiode

USA . 3,238 parts In-Stock

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3,238

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,754 parts In-Stock

1+ parts

$13.570

100+ parts

$1,260.165

1k+ parts

$12.213

10k+ parts

-

1,754

$13.570

$1,260.165

$12.213

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DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$14.942

100+ parts

$13.747

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-

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369

$14.942

$13.747

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ChromeModa Solutions

Germany . 3,089 parts In-Stock

1+ parts

$15.247

100+ parts

$12.503

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3,089

$15.247

$12.503

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$15.247

100+ parts

$14.485

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$13.722

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1,243

$15.247

$14.485

$13.722

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AZTECH Wire

Italy . 873 parts In-Stock

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$16.400

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873

$16.400

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One Stop Electronics

USA . 577 parts In-Stock

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$24.000

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577

$24.000

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Component Stockers USA

USA . 775 parts In-Stock

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$99.990

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775

$99.990

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Corphita

USA . 1,765 parts In-Stock

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Microchip USA

USA . 346 parts In-Stock

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346

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Overview

Unlock the power of precision and reliability with the THS5671AIDWR by Texas Instruments. As a leader in digital-to-analog converters, Texas Instruments ensures top-notch quality and cutting-edge technology in every product. Ideal for a wide range of applications, this D/A converter offers unmatched value and benefits to customers looking for high performance and efficiency. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

Provides a high maximum analog output voltage for accurate signal conversion.

No. of Bits: 14

Offers high resolution for precise analog to digital conversion.

Nominal Settling Time (tstl): 0.035 us

Fast settling time ensures quick and accurate conversion results.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Operating Temperature: -40 to 85 °C

Wide operating temperature range suitable for various industrial applications.

Surface Mount: YES

Convenient surface mount design for easy installation on circuit boards.

Technical Specifications

Digital-to-Analog Converters THS5671AIDWR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0427 %

Nominal Settling Time (tstl):

35 ns

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3/5,5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.49 mm)

Length:

0.705 in (17.905 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

Trade Compliance

THS5671AIDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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