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THS5641AIPWG4

Texas Instruments

THS5641AIPWG4 by Texas Instruments

THS5641AIPWG4 by Texas Instruments is an 8-bit D/A converter with max analog output voltage of 1.25V, linearity error of 0.0977%, and settling time of 0.035us. Ideal for industrial applications requiring precise voltage conversion in a compact package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,924 parts In-Stock

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Digiode

USA . 2,894 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,258 parts In-Stock

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$3.000

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$3.000

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Parana Technologies

USA . 1,733 parts In-Stock

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$15.945

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$1,480.757

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$14.351

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1,733

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$1,480.757

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AZTECH Wire

Italy . 628 parts In-Stock

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$16.419

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DigiPath Technology Company

USA . 1,962 parts In-Stock

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$17.558

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$16.153

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1,962

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ChromeModa Solutions

Germany . 4,556 parts In-Stock

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$17.916

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$14.691

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4,556

$17.916

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IDEA Electronic Components Group

UK . 226 parts In-Stock

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$17.916

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$17.020

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$16.124

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226

$17.916

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Component Stockers USA

USA . 458 parts In-Stock

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$99.990

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Corphita

USA . 4,936 parts In-Stock

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Perfect Parts

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Overview

Elevate your digital-to-analog conversion game with the THS5641AIPWG4 from Texas Instruments. Known for their top-tier quality and cutting-edge technology, Texas Instruments delivers excellence in every product. The THS5641AIPWG4 is a game-changer in the world of digital-to-analog converters, offering unparalleled precision and performance. Whether you're working on industrial automation, telecommunications, or test and measurement applications, this converter is your go-to solution. Say hello to faster processing speeds, smoother operation, and superior results with the THS5641AIPWG4. Elevate your projects and experience the difference today!

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

This high maximum output voltage allows for a wide range of analog signals to be accurately converted, making this product versatile and suitable for various applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and makes the product resistant to external factors such as moisture or temperature changes, increasing its lifespan.

Surface Mount: YES

Being surface mountable makes installation and assembly of this product easier and more efficient, saving time and effort during production.

No. of Bits: 8

With a high number of bits, this product offers precise and accurate digital-to-analog conversion, resulting in high-quality output signals with minimal distortion.

Maximum Linearity Error (EL): 0.0977 %

The low maximum linearity error ensures that the output closely matches the input signal, providing accurate conversion and reliable performance.

Power Supplies (V): 3.3/5

Support for multiple power supply options allows for flexibility and compatibility with various systems, making this product suitable for a wide range of applications.

Technical Specifications

Digital-to-Analog Converters THS5641AIPWG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, 8 Bits

Input Bit Code:

Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

35 ns

No. of Bits:

8

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.382 in (9.7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

THS5641AIPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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