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THS4501CDGKRG4

Texas Instruments

THS4501CDGKRG4 by Texas Instruments

THS4501CDGKRG4 by Texas Instruments is an Operational Amplifier with 0 uV Max Input Offset Voltage, 5 uA Max Average Bias Current, and 80 dB Nominal CMRR. Ideal for applications requiring precise signal amplification in commercial temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,809 parts In-Stock

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Digiode

USA . 3,956 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Parana Technologies

USA . 1,215 parts In-Stock

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$6.323

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$7.072

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Ampacity Inc.

Singapore . 825 parts In-Stock

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$6.410

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Corohmni

South Africa . 459 parts In-Stock

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$6.704

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DigiPath Technology Company

USA . 1,308 parts In-Stock

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$6.963

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$6.406

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$6.963

$6.406

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ChromeModa Solutions

Germany . 5,372 parts In-Stock

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$7.105

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$5.826

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IDEA Electronic Components Group

UK . 1,761 parts In-Stock

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$7.105

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$6.394

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One Stop Electronics

USA . 1,499 parts In-Stock

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$8.410

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AZTECH Wire

Italy . 861 parts In-Stock

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Corphita

USA . 4,744 parts In-Stock

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Continental Prestige Electronics

USA . 3,039 parts In-Stock

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Argo Parts USA

USA . 1,176 parts In-Stock

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Microchip USA

USA . 452 parts In-Stock

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Bastille Electronics

Australia . 83 parts In-Stock

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Overview

Elevate your projects with the THS4501CDGKRG4 by Texas Instruments, a high-quality operational amplifier designed for precision and reliability. Manufactured by industry leader Texas Instruments, this op amp offers unparalleled performance and versatility. Ideal for a variety of applications, this product delivers exceptional value, benefits, and advantages to customers seeking top-tier components. Experience seamless integration and superior functionality with the THS4501CDGKRG4, setting a new standard in operational amplifiers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good insulation, ensuring the longevity of the product.

Maximum Input Offset Voltage: 0 uV

This extremely low offset voltage ensures accurate signal processing without any distortions or errors.

Nominal Common Mode Reject Ratio: 80 dB

High common-mode rejection ratio ensures that only the differential input signal is amplified, leading to improved signal fidelity.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent performance of the operational amplifier.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various environmental conditions without compromising performance.

Nominal Unity Gain Bandwidth: 300000 kHz

High unity gain bandwidth indicates the amplifier's capability to handle high-frequency signals efficiently.

Nominal Slow Rate: 92 V/us

Fast slew rate ensures rapid response to input voltage changes, making it suitable for applications requiring quick signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) THS4501CDGKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

5/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

300 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

0 uV

Nominal Slew Rate:

92 V/us

Peak Bias Current:

5 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

32 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4501CDGKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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