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THS4221DGNR

Texas Instruments

THS4221DGNR by Texas Instruments

THS4221DGNR by Texas Instruments is an Operational Amplifier with 8 terminals in a small square package. It features a terminal pitch of 0.65 mm, suitable for industrial applications requiring precise amplification. The GULL WING terminal form and surface mount capability make it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,053 parts In-Stock

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9,053

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Digiode

USA . 3,899 parts In-Stock

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3,899

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Distributors (Availability)

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Parana Technologies

USA . 1,290 parts In-Stock

1+ parts

$5.132

100+ parts

-

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$5.722

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1,290

$5.132

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$5.722

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$5.766

100+ parts

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$5.189

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2,177

$5.766

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$5.189

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ChromeModa Solutions

Germany . 2,101 parts In-Stock

1+ parts

$5.766

100+ parts

$4.728

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2,101

$5.766

$4.728

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One Stop Electronics

USA . 350 parts In-Stock

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$6.410

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350

$6.410

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AZTECH Wire

Italy . 614 parts In-Stock

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$9.976

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614

$9.976

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Lixinc

USA . 11,697 parts In-Stock

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11,697

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A-Z Elektronik GmbH

Germany . 7,212 parts In-Stock

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Corphita

USA . 2,011 parts In-Stock

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2,011

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DigiPath Technology Company

USA . 1,046 parts In-Stock

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$5.199

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1,046

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$5.199

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Microchip USA

USA . 407 parts In-Stock

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Overview

Elevate your electronic designs with the THS4221DGNR by Texas Instruments, a high-quality operational amplifier that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this op amp is ideal for a wide range of applications, from audio equipment to signal processing. With its compact package design and industrial-grade temperature rating, the THS4221DGNR offers exceptional value and benefits to customers seeking precision and efficiency in their projects. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the operational amplifier, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape ensures uniformity and easy alignment during assembly, enhancing the overall reliability of the operational amplifier.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting the operational amplifier to other components, enabling a wide range of circuit configurations and applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The combination of small outline, heat sink/slug, thin profile, and shrink pitch package styles allows for efficient heat dissipation and compact design, ideal for industrial settings.

Terminal Position: DUAL

Dual terminal position enhances the stability and connectivity of the operational amplifier, ensuring reliable performance in various operating conditions.

Maximum Seated Height: 1.07 mm

Low maximum seated height enables the operational amplifier to be used in space-constrained applications without compromising on performance or reliability.

Width: 3 mm

Compact width dimension allows for efficient use of space on circuit boards, contributing to a streamlined and organized layout.

Length: 3 mm

Short length dimension further enhances space-saving benefits, making the operational amplifier suitable for compact electronic devices and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring stable and reliable operation in harsh environmental conditions typically found in industrial applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, minimizing the risk of disconnection or signal interference in the operational amplifier.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed as an operational amplifier, tailored for precise and high-performance signal processing in various industrial circuits and systems.

Terminal Pitch: 0.65 mm

Narrow terminal pitch facilitates precise and efficient connections, allowing for compact circuit designs and enhanced signal integrity.

Technical Specifications

Operational Amplifiers (Op Amps) THS4221DGNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS4221DGNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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