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THS4151CDGNR

Texas Instruments

THS4151CDGNR by Texas Instruments

THS4151CDGNR by Texas Instruments is an Operational Amplifier with 8500uV Max Input Offset Voltage, 15uA Max Average Bias Current, and 83dB Nominal CMRR. Ideal for applications requiring a small outline, thin profile package such as signal conditioning circuits in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,505 parts In-Stock

1+ parts

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4,505

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Vyrian

USA . 3,739 parts In-Stock

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3,739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 613 parts In-Stock

1+ parts

$4.700

100+ parts

-

1k+ parts

$5.187

10k+ parts

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613

$4.700

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$5.187

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DigiPath Technology Company

USA . 2,148 parts In-Stock

1+ parts

$5.175

100+ parts

$4.761

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2,148

$5.175

$4.761

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ChromeModa Solutions

Germany . 2,329 parts In-Stock

1+ parts

$5.281

100+ parts

$4.330

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2,329

$5.281

$4.330

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IDEA Electronic Components Group

UK . 992 parts In-Stock

1+ parts

$5.281

100+ parts

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$4.753

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992

$5.281

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$4.753

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One Stop Electronics

USA . 390 parts In-Stock

1+ parts

$9.410

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390

$9.410

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AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$19.520

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193

$19.520

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Component Stockers USA

USA . 700 parts In-Stock

1+ parts

$99.990

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700

$99.990

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Corphita

USA . 3,680 parts In-Stock

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3,680

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Microchip USA

USA . 413 parts In-Stock

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413

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the THS4151CDGNR Operational Amplifier. This cutting-edge technology offers customers a versatile solution for various applications, delivering exceptional performance and precision. With a small outline package and commercial-grade temperature range, this amplifier is perfect for a wide range of projects. Trust in Texas Instruments to provide top-of-the-line products that exceed expectations and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Maximum Input Offset Voltage: 8500 uV

The low input offset voltage ensures accuracy in signal processing and minimizes errors in the output signal.

Maximum Average Bias Current (IIB): 15 uA

The low bias current ensures minimal power consumption and stable performance over time.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact electronic designs.

Nominal Common Mode Reject Ratio: 83 dB

The high common mode rejection ratio helps in rejecting unwanted noise and interference in the signal.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes it compatible with standard power sources, ensuring ease of use.

Technology: BIPOLAR

Bipolar technology offers high input impedance and low noise, making the op amp suitable for precision applications.

Maximum Supply Current: 23 mA

The low maximum supply current ensures efficient power usage and minimal heat dissipation.

Technical Specifications

Operational Amplifiers (Op Amps) THS4151CDGNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

±5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Input Offset Voltage Limit:

8500 uV

Nominal Slew Rate:

650 V/us

Peak Bias Current:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

23 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4151CDGNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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