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THS4140CDGNR

Texas Instruments

THS4140CDGNR by Texas Instruments

THS4140CDGNR by Texas Instruments is an Operational Amplifier with 8500uV Max Input Offset Voltage, 15uA Max Average Bias Current, and 84dB Nominal CMRR. Ideal for applications requiring precise signal amplification in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,725 parts In-Stock

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7,725

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Digiode

USA . 2,206 parts In-Stock

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2,206

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Distributors (Availability)

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One Stop Electronics

USA . 292 parts In-Stock

1+ parts

$0.410

100+ parts

-

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292

$0.410

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Parana Technologies

USA . 1,284 parts In-Stock

1+ parts

$3.787

100+ parts

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$4.277

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1,284

$3.787

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$4.277

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DigiPath Technology Company

USA . 204 parts In-Stock

1+ parts

$4.170

100+ parts

$3.836

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204

$4.170

$3.836

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ChromeModa Solutions

Germany . 2,427 parts In-Stock

1+ parts

$4.255

100+ parts

$3.489

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2,427

$4.255

$3.489

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IDEA Electronic Components Group

UK . 1,956 parts In-Stock

1+ parts

$4.255

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$3.830

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1,956

$4.255

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$3.830

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AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$11.250

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773

$11.250

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A-Z Elektronik GmbH

Germany . 6,762 parts In-Stock

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6,762

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Corphita

USA . 4,969 parts In-Stock

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Microchip USA

USA . 3,160 parts In-Stock

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Overview

Elevate your electronic designs with the THS4140CDGNR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality operational amplifiers for a wide range of applications. Whether you're working on audio equipment, signal processing systems, or control systems, this operational amplifier offers unmatched performance and reliability. With a compact design and versatile features, the THS4140CDGNR provides exceptional value to customers seeking precision and efficiency in their projects. Experience the benefits of Texas Instruments' expertise and innovation with the THS4140CDGNR - the perfect choice for your next electronic project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability in various environmental conditions.

Maximum Input Offset Voltage: 8500 uV

Low input offset voltage ensures accurate and precise amplification of signals.

Maximum Average Bias Current (IIB): 15 uA

Low bias current ensures minimal power consumption and stable operation.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Common Mode Reject Ratio: 84 dB

High common mode rejection ratio helps in reducing noise and interference in signal processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with a wide range of applications.

Power Supplies (V): 5/30/+-2.5/+-15

Ability to support multiple power supply voltages provides flexibility in circuit design.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity and integration in circuits.

Maximum Supply Voltage Limit: 16.5 V

High supply voltage limit ensures safe operation without risk of damage.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in various thermal conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures makes it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position facilitates easy connectivity and layout in circuit boards.

Maximum Seated Height: 1.07 mm

Low seated height enables compact designs and space-saving in electronic devices.

Width: 3 mm

Compact width makes it suitable for applications with limited space constraints.

Length: 3 mm

Compact length allows for efficient placement on circuit boards.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Maximum Negative Supply Voltage Limit: -16.5 V

Support for negative supply voltage allows for bipolar operation and versatility in circuit design.

Technology: BIPOLAR

Bipolar technology offers high precision and stability in signal amplification.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and installation on PCBs.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifier type provides high gain and accurate signal processing capabilities.

Maximum Supply Current: 18 mA

Low supply current consumption ensures energy efficiency and prolonged battery life.

Nominal Negative Supply Voltage (Vsup): -5 V

Nominal negative supply voltage enables bipolar operation and enhanced signal processing.

Nominal Slow Rate: 450 V/us

High slew rate ensures fast response time and precise signal amplification.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and compact circuit designs.

Technical Specifications

Operational Amplifiers (Op Amps) THS4140CDGNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5/30/±2.5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

84 dB

Input Offset Voltage Limit:

8500 uV

Nominal Slew Rate:

450 V/us

Peak Bias Current:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

18 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4140CDGNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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