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TFP101APZP

Texas Instruments

TFP101APZP by Texas Instruments

TFP101APZP by Texas Instruments is a 100-terminal consumer IC with 3.3V power supply, operating from 0 to 70°C. It features CMOS technology, GULL WING terminals, and a compact square package suitable for various consumer circuit applications.

Median Price

$7.894

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 40 parts In-Stock

1+ parts

$5.450

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$5.450

-

-

-

Texas Instruments

USA . 520 parts In-Stock

1+ parts

$7.894

100+ parts

$6.435

1k+ parts

$4.290

10k+ parts

-

520

$7.894

$6.435

$4.290

-

Rochester

USA . 70,017 parts In-Stock

1+ parts

-

100+ parts

$7.090

1k+ parts

$6.340

10k+ parts

$5.970

70,017

-

$7.090

$6.340

$5.970

DigiKey

USA . 70,017 parts In-Stock

1+ parts

-

100+ parts

$9.320

1k+ parts

-

10k+ parts

-

70,017

-

$9.320

-

-

Verical

USA . 39,825 parts In-Stock

1+ parts

-

100+ parts

$8.863

1k+ parts

$7.925

10k+ parts

$7.463

39,825

-

$8.863

$7.925

$7.463

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,528 parts In-Stock

1+ parts

$3.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,528

$3.990

-

-

-

Vyrian

USA . 2,349 parts In-Stock

1+ parts

$4.200

100+ parts

-

1k+ parts

-

10k+ parts

-

2,349

$4.200

-

-

-

DigiKey Marketplace

USA . 70,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

70,129

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

116

-

-

-

-

Semtec, LLC

USA . 46 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46

-

-

-

-

LIBRA Elektronik GmbH

Germany . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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30

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,050 parts In-Stock

1+ parts

$0.559

100+ parts

-

1k+ parts

$1.658

10k+ parts

-

2,050

$0.559

-

$1.658

-

ChromeModa Solutions

Germany . 1,006 parts In-Stock

1+ parts

$0.628

100+ parts

$0.515

1k+ parts

-

10k+ parts

-

1,006

$0.628

$0.515

-

-

IDEA Electronic Components Group

UK . 185 parts In-Stock

1+ parts

$0.628

100+ parts

-

1k+ parts

$0.565

10k+ parts

-

185

$0.628

-

$0.565

-

Corphita

USA . 4,570 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

4,570

$3.780

-

-

-

Microchip USA

USA . 432 parts In-Stock

1+ parts

$18.120

100+ parts

$17.990

1k+ parts

$17.990

10k+ parts

$17.860

432

$18.120

$17.990

$17.990

$17.860

DigiPath Technology Company

USA . 884 parts In-Stock

1+ parts

-

100+ parts

$0.566

1k+ parts

-

10k+ parts

-

884

-

$0.566

-

-

Authorized Procurement Solutions

USA . 46 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

46

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the TFP101APZP by Texas Instruments. Crafted with precision and expertise, this consumer circuit IC boasts unparalleled quality and reliability. Perfect for a wide range of applications, this versatile product offers exceptional value and benefits to customers looking for seamless performance and efficiency. Discover the advantages of Texas Instruments and elevate your projects to new heights with the TFP101APZP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good protection for the internal components of the IC, making it more durable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving design, making it suitable for compact consumer electronics.

Power Supplies (V): 3.3

The 3.3V power supply is compatible with many common electronic devices, providing stable and efficient power.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this IC can function reliably in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs TFP101APZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

350 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP101APZP General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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