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TFP101ACPZP

Texas Instruments

TFP101ACPZP by Texas Instruments

TFP101ACPZP by Texas Instruments is a 3.3V CONSUMER CIRCUIT IC with 100 terminals in a SQUARE package. It operates b/w 0-70°C, suitable for COMMERCIAL applications requiring fine pitch and thin profile design. This PLASTIC/EPOXY IC supports surface mount assembly and has GULL WING terminals with 0.5mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,086

-

-

-

-

Digiode

USA . 3,789 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,789

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,355 parts In-Stock

1+ parts

$2.790

100+ parts

-

1k+ parts

$3.275

10k+ parts

-

2,355

$2.790

-

$3.275

-

ChromeModa Solutions

Germany . 935 parts In-Stock

1+ parts

$3.135

100+ parts

$2.571

1k+ parts

-

10k+ parts

-

935

$3.135

$2.571

-

-

IDEA Electronic Components Group

UK . 456 parts In-Stock

1+ parts

$3.135

100+ parts

-

1k+ parts

$2.822

10k+ parts

-

456

$3.135

-

$2.822

-

AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$9.088

100+ parts

-

1k+ parts

-

10k+ parts

-

679

$9.088

-

-

-

One Stop Electronics

USA . 1,548 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,548

$14.800

-

-

-

Corphita

USA . 1,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,466

-

-

-

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DigiPath Technology Company

USA . 1,034 parts In-Stock

1+ parts

-

100+ parts

$2.827

1k+ parts

-

10k+ parts

-

1,034

-

$2.827

-

-

Overview

Discover the innovative TFP101ACPZP by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. With a sleek square package design and surface mount capability, this versatile IC is perfect for a range of consumer circuit applications. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing to deliver a product that exceeds expectations. Experience the value and benefits of the TFP101ACPZP, from its low power consumption to its wide operating temperature range. Upgrade your electronics with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for consumer applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation and PCB assembly, reducing manufacturing time and costs.

Power Supplies (V): 3.3

The power supply of 3.3V is a common voltage level in consumer electronics, ensuring compatibility with various devices.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options and flexibility for designing complex consumer circuits.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this product can withstand extended use and environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable for consumer applications.

Technical Specifications

Other Function Consumer ICs TFP101ACPZP attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TFP101ACPZP General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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