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TAS5616PHD

Texas Instruments

TAS5616PHD by Texas Instruments

TAS5616PHD by Texas Instruments is a 160W audio amplifier IC with 2 channels. It operates b/w 0-70°C, suitable for commercial use. The package style is flatpack with a thin profile, featuring a terminal pitch of 0.8mm for surface mount applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,806 parts In-Stock

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3,806

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Digiode

USA . 208 parts In-Stock

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208

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,376 parts In-Stock

1+ parts

$1.565

100+ parts

-

1k+ parts

$2.207

10k+ parts

-

1,376

$1.565

-

$2.207

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ChromeModa Solutions

Germany . 5,501 parts In-Stock

1+ parts

$1.758

100+ parts

$1.442

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-

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5,501

$1.758

$1.442

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IDEA Electronic Components Group

UK . 1,704 parts In-Stock

1+ parts

$1.758

100+ parts

-

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$1.582

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1,704

$1.758

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$1.582

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One Stop Electronics

USA . 747 parts In-Stock

1+ parts

$2.800

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747

$2.800

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AZTECH Wire

Italy . 521 parts In-Stock

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$19.180

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521

$19.180

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Corphita

USA . 415 parts In-Stock

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415

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Microchip USA

USA . 352 parts In-Stock

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352

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DigiPath Technology Company

USA . 116 parts In-Stock

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$1.585

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116

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$1.585

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Overview

Unleash the power of your audio and video systems with the TAS5616PHD by Texas Instruments. Crafted with precision and expertise, this audio amplifier delivers unparalleled sound quality and performance. Whether you're a music enthusiast, home theater buff, or professional in the entertainment industry, this versatile amplifier is sure to elevate your listening experience to new heights. With a robust design and advanced features, the TAS5616PHD offers exceptional value, reliability, and efficiency, making it an essential component for any audio setup. Upgrade your sound system today and feel the difference with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the amplifier.

General IC Type: AUDIO AMPLIFIER

Specifically designed for amplifying audio signals, making it a reliable choice for audio applications.

Nominal Output Power: 160 W

Offers high power output for clear and powerful audio amplification, suitable for various audio systems.

Maximum Supply Voltage: 52.5 V

Supports a wide range of supply voltages, allowing for flexibility in different power supply setups.

No. of Channels: 2

Provides dual-channel audio amplification, ideal for stereo sound reproduction and multi-speaker setups.

Technical Specifications

Audio & Video Amplifiers TAS5616PHD attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

5A

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

160 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12,50

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

52.5 V

Minimum Supply Voltage (Vsup):

25 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

TAS5616PHD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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