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TAS5414TDKDRQ1

Texas Instruments

TAS5414TDKDRQ1 by Texas Instruments

TAS5414TDKDRQ1 by Texas Instruments is an AEC-Q100 compliant audio amplifier IC with 4 channels and 116W output power. Operating temperature range from -40 to 105°C, suitable for industrial applications. Features small outline package with gull wing terminals, ideal for automotive audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,916 parts In-Stock

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Digiode

USA . 1,185 parts In-Stock

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1,185

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Distributors (Availability)

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Parana Technologies

USA . 1,264 parts In-Stock

1+ parts

$2.262

100+ parts

-

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$2.763

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1,264

$2.262

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$2.763

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IDEA Electronic Components Group

UK . 1,986 parts In-Stock

1+ parts

$2.542

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$2.288

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1,986

$2.542

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$2.288

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ChromeModa Solutions

Germany . 1,231 parts In-Stock

1+ parts

$2.542

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$2.084

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$2.542

$2.084

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AZTECH Wire

Italy . 533 parts In-Stock

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$7.069

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533

$7.069

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One Stop Electronics

USA . 704 parts In-Stock

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$8.800

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704

$8.800

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Component Stockers USA

USA . 610 parts In-Stock

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$99.990

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610

$99.990

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A-Z Elektronik GmbH

Germany . 4,694 parts In-Stock

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Corphita

USA . 4,149 parts In-Stock

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Microchip USA

USA . 2,577 parts In-Stock

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DigiPath Technology Company

USA . 2,243 parts In-Stock

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$2.292

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2,243

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Overview

Enhance your audio experience with the TAS5414TDKDRQ1 by Texas Instruments, a top-of-the-line audio amplifier designed for optimum performance. As a trusted manufacturer in the industry, Texas Instruments delivers superior quality and reliability. Ideal for a wide range of applications, this amplifier offers unparalleled value with its powerful output, compact design, and wide temperature range. Elevate your audio projects with the TAS5414TDKDRQ1 and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the amplifier components, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on PCBs and saves space in the overall design.

Screening Level: AEC-Q100

Meets automotive electronic component standards, ensuring reliability and performance in harsh environments.

Nominal Output Power: 116 W

High output power capability for driving speakers with clarity and volume.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, ideal for automotive or industrial applications.

No. of Channels: 4

Allows for multiple audio channels, providing a richer sound experience.

Technical Specifications

Audio & Video Amplifiers TAS5414TDKDRQ1 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

General IC Type:

Gain:

32 dB

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

116 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

14.4

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

3.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

22 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11 mm

Trade Compliance

TAS5414TDKDRQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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