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SNJ54S139W

Texas Instruments

SNJ54S139W by Texas Instruments

SNJ54S139W by Texas Instruments is a TTL technology decoder with 2 functions, 12 ns propagation delay, and inverted output polarity. It operates in military-grade temperature range from -55 to 125 °C and has a max supply voltage of 5.5 V. Ideal for applications requiring fast signal decoding in harsh environments.

Median Price

$15.528

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 105 parts In-Stock

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$15.528

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$16.304

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$15.372

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Vyrian

USA . 3,788 parts In-Stock

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Digiode

USA . 1,885 parts In-Stock

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Electronic Expediters

USA . 82 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 68 parts In-Stock

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Bristol Electronics

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Dan-Mar Components

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Mil-Aero Solutions, Inc.

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Electro Mavin

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Inland Empire Components Inc.

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American Connector Supply Corp

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 261 parts In-Stock

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$16.502

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One Stop Electronics

USA . 270 parts In-Stock

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Parana Technologies

USA . 108 parts In-Stock

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DigiPath Technology Company

USA . 1,816 parts In-Stock

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$24.348

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$22.400

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ChromeModa Solutions

Germany . 4,918 parts In-Stock

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$24.845

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IDEA Electronic Components Group

UK . 2,176 parts In-Stock

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Component Stockers USA

USA . 530 parts In-Stock

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$99.990

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Corphita

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Microchip USA

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Overview

Looking for a reliable and high-quality Decoder & Drivers? Look no further than the Texas Instruments SNJ54S139W. With its MIL-PRF-38535 screening level, this product ensures top-notch performance in military-grade applications. Its 12 ns propagation delay and inverted output polarity make it ideal for a wide range of projects. Trust Texas Instruments to provide cutting-edge technology and superior manufacturing, giving you peace of mind knowing you have a dependable solution at your fingertips. Elevate your designs with the SNJ54S139W today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 12 ns

The fast propagation delay ensures quick response times and efficient performance.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated environmental conditions.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of systems and devices.

Technical Specifications

Decoder & Drivers SNJ54S139W attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

SCHOTTKY CLAMPED FOR HIGH PERFORMANCE

Family:

S

Input Conditioning:

STANDARD

JESD-30 Code:

R-CDFP-F16

JESD-609 Code:

e0

Length:

10.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

74 mA

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.73 mm

Trade Compliance

SNJ54S139W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-110-3843, 5962011103843

NIIN

011103843

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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