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SNJ54LV123AW

Texas Instruments

SNJ54LV123AW by Texas Instruments

SNJ54LV123AW by Texas Instruments is a Prescaler & Multivibrator with 2 functions, operating at 2.5V to 3.3V. It has a propagation delay of 42ns and can withstand temperatures from -55°C to 125°C. Ideal for military applications due to MIL-PRF-38535 screening level and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,738 parts In-Stock

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2,738

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Digiode

USA . 1,481 parts In-Stock

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1,481

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$12.342

100+ parts

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203

$12.342

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Parana Technologies

USA . 293 parts In-Stock

1+ parts

$25.289

100+ parts

$2,348.500

1k+ parts

$22.760

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293

$25.289

$2,348.500

$22.760

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$27.847

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694

$27.847

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ChromeModa Solutions

Germany . 3,523 parts In-Stock

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$28.415

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$23.300

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3,523

$28.415

$23.300

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$28.415

100+ parts

$26.994

1k+ parts

$25.574

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2,378

$28.415

$26.994

$25.574

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One Stop Electronics

USA . 881 parts In-Stock

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$38.000

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881

$38.000

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Corphita

USA . 1,583 parts In-Stock

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1,583

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Overview

Elevate your electronic designs with the SNJ54LV123AW by Texas Instruments. Crafted with precision and quality, this prescaler & multivibrator offers unmatched reliability and performance. Whether you're working on military-grade applications or commercial projects, this versatile component delivers exceptional value and benefits. Trust in Texas Instruments to provide cutting-edge technology that enhances your creations. Experience the advantage of using the SNJ54LV123AW in your next project and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low voltage, making it suitable for a variety of electronic systems.

Propagation Delay (tpd): 42 ns

Provides efficient signal processing with minimal delay, enhancing overall performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it ideal for applications where heat resistance is necessary.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving energy efficiency and signal reliability.

Technical Specifications

Prescaler & Multivibrators SNJ54LV123AW attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

EDGE TRIGGERED FROM ACTIVE-HIGH OR ACTIVE-LOW GATED LOGIC INPUTS

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-GDFP-F16

Length:

10.16 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.25

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54LV123AW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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