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SNJ54123J

Texas Instruments

SNJ54123J by Texas Instruments

SNJ54123J by Texas Instruments is a dual-function TTL device with 2 bits, operating at 5V. With a propagation delay of 40ns and MILITARY temperature grade, it's ideal for applications requiring fast signal processing in harsh environments. The package style is IN-LINE, making it suitable for through-hole mounting in military-grade electronics.

Median Price

$11.637

Lifecycle Status

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Chip1Stop

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Ace Electronics

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American Microsemiconductor Inc.

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Mil-Aero Solutions, Inc.

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Atlantic Semiconductor

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Corel Iberica Componentes, S.L.

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Electronic Expediters

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Electro Mavin

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Beltway Electronics Company

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Component Sense

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Holdelec - ElecDif-Pro

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

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IDEA Electronic Components Group

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Lixinc

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Overview

Elevate your circuit designs with the SNJ54123J by Texas Instruments, a top-quality prescaler and multivibrator that delivers unmatched performance and reliability. Manufactured with precision and expertise, this versatile component is ideal for a wide range of applications, offering customers unparalleled value and benefits. From its MIL-PRF-38535 screening level to its dual terminal position, this product is designed to meet the highest standards in quality and functionality. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Functions: 2

Having multiple functions in one device can save space on a circuit board and reduce overall component count.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage that is commonly used in many electronic applications, making it easy to integrate this product into existing systems.

Propagation Delay (tpd): 40 ns

Low propagation delay ensures fast and efficient signal processing, improving the overall performance of the system.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments or applications that generate heat.

Technical Specifications

Prescaler & Multivibrators SNJ54123J attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

RETRIGGERABLE

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

21.34 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Bits:

2

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

36 mA

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54123J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-348-2717, 5962003482717, 5962-01-104-1697, 5962011041697, 5962-01-154-2901, 5962011542901, 5962-01-074-8047, 5962010748047, 5962-01-309-1054, 5962013091054

NIIN

003482717, 011041697, 011542901, 010748047, 013091054

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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