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SNJ54LV123AFK

Texas Instruments

SNJ54LV123AFK by Texas Instruments

SNJ54LV123AFK by Texas Instruments is a CMOS Prescaler & Multivibrator with 2 functions, 42ns propagation delay, and operates in a temperature range of -55 to 125°C. It has a package style of CHIP CARRIER and is MIL-PRF-38535 screened for military applications. The device features complementary output polarity and requires a supply voltage b/w 2V to 5.5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,126 parts In-Stock

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Digiode

USA . 3,185 parts In-Stock

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3,185

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,190 parts In-Stock

1+ parts

$5.000

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1,190

$5.000

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AZTECH Wire

Italy . 787 parts In-Stock

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$16.844

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787

$16.844

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Parana Technologies

USA . 295 parts In-Stock

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$18.352

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$18.478

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295

$18.352

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$18.478

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DigiPath Technology Company

USA . 742 parts In-Stock

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$20.208

100+ parts

$18.591

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742

$20.208

$18.591

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ChromeModa Solutions

Germany . 4,362 parts In-Stock

1+ parts

$20.620

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$16.908

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4,362

$20.620

$16.908

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IDEA Electronic Components Group

UK . 560 parts In-Stock

1+ parts

$20.620

100+ parts

$19.589

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$18.558

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560

$20.620

$19.589

$18.558

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Corphita

USA . 4,987 parts In-Stock

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Overview

Unlock the potential of your electronic projects with the SNJ54LV123AFK by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments brings you this versatile Prescaler & Multivibrator component that promises seamless integration and precise performance. Ideal for a wide range of applications, from industrial automation to consumer electronics, this product offers exceptional value with its advanced features and efficient design. Trust Texas Instruments to deliver cutting-edge technology that empowers your innovations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, simplifying the assembly process.

Propagation Delay (tpd): 42 ns

Low propagation delay ensures fast signal processing, making the product efficient in time-sensitive applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring stable performance even in demanding conditions.

Minimum Operating Temperature: -55 °C

Operational in extremely low temperatures, providing versatility in different operating environments.

Technical Specifications

Prescaler & Multivibrators SNJ54LV123AFK attributes and parameters. Explore more Prescaler & Multivibrators devices from Texas Instruments

Specs

Additional Features:

EDGE TRIGGERED FROM ACTIVE-HIGH OR ACTIVE-LOW GATED LOGIC INPUTS

Family:

LV/LV-A/LVX/H

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Logic IC Type:

No. of Data/Clock Inputs:

2

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Propagation Delay (tpd):

42 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Prescaler/Multivibrators

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54LV123AFK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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