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SNJ54LS673FK

Texas Instruments

SNJ54LS673FK by Texas Instruments

SNJ54LS673FK by Texas Instruments is a 16-bit digital shift register with a propagation delay of 40 ns. It operates at a supply voltage range of 4.75V to 5.25V and has a max frequency of 20MHz. Ideal for military-grade applications requiring fast data shifting capabilities in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,392 parts In-Stock

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Digiode

USA . 2,452 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 75 parts In-Stock

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Advanced Electronics

New Zealand . 70 parts In-Stock

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$12.184

100+ parts

$11.087

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$9.991

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70

$12.184

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$9.991

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AZTECH Wire

Italy . 543 parts In-Stock

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$13.084

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One Stop Electronics

USA . 1,507 parts In-Stock

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$21.000

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Parana Technologies

USA . 1,862 parts In-Stock

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$24.172

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$24.829

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$24.172

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$24.829

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DigiPath Technology Company

USA . 1,397 parts In-Stock

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$26.616

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$24.487

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$26.616

$24.487

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ChromeModa Solutions

Germany . 5,650 parts In-Stock

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$27.159

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$22.270

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$27.159

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IDEA Electronic Components Group

UK . 1,545 parts In-Stock

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$27.159

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$25.801

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$24.443

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Microchip USA

USA . 1,420 parts In-Stock

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Corphita

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Overview

Upgrade your digital shift register capabilities with the SNJ54LS673FK by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable solutions for various applications. This 16-bit chip carrier with a propagation delay of 40 ns offers fast and efficient performance, making it ideal for military-grade projects. With a maximum operating temperature of 125°C and a true output polarity, this product provides unmatched value and benefits to customers looking for high-performance digital shift registers. Upgrade to Texas Instruments for superior quality and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and protection, making the product suitable for harsh environments.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the output signal, enabling efficient data transmission.

Maximum Frequency At Nominal Supply: 20,000,000 Hz

The high operating frequency makes this product ideal for applications requiring fast data processing and transmission.

Trigger Type: NEGATIVE EDGE

The negative edge trigger ensures precise timing control, enhancing the reliability and accuracy of the data output.

Technical Specifications

Digital Shift Registers SNJ54LS673FK attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

PARALLEL OUTPUT IS REGISTERED; ASYNCHRONOUS CLEAR FOR STORAGE REGISTER; COMMON SERIAL I/O PIN

Count Direction:

RIGHT

Family:

LS

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Load Capacitance (CL):

45 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

16

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

NEGATIVE EDGE

Width:

11.43 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54LS673FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-393-3062, 5962013933062

NIIN

013933062

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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