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SNJ54178W

Texas Instruments

SNJ54178W by Texas Instruments

SNJ54178W by Texas Instruments is a 4-bit digital shift register with a propagation delay of 35 ns and operates on a supply voltage range of 4.5V to 5.5V. It is designed for military-grade applications, featuring negative edge triggering and a max operating temperature of 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,539 parts In-Stock

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4,539

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Vyrian

USA . 3,528 parts In-Stock

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3,528

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Distributors (Availability)

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Parana Technologies

USA . 1,343 parts In-Stock

1+ parts

$9.514

100+ parts

-

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$10.114

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1,343

$9.514

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$10.114

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DigiPath Technology Company

USA . 1,793 parts In-Stock

1+ parts

$10.476

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1,793

$10.476

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ChromeModa Solutions

Germany . 2,072 parts In-Stock

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$10.690

100+ parts

$8.766

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2,072

$10.690

$8.766

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$10.690

100+ parts

$10.156

1k+ parts

$9.621

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1,833

$10.690

$10.156

$9.621

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AZTECH Wire

Italy . 259 parts In-Stock

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$14.007

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259

$14.007

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One Stop Electronics

USA . 294 parts In-Stock

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$23.000

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294

$23.000

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Corphita

USA . 3,623 parts In-Stock

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Overview

Enhance your digital systems with the Texas Instruments SNJ54178W, a high-quality 4-bit shift register designed for military-grade applications. With a maximum operating temperature of 125°C and a propagation delay of just 35ns, this product offers unparalleled reliability and performance. Ideal for demanding environments, this flatpack style shift register is perfect for applications requiring a true output polarity and negative edge trigger type. Trust Texas Instruments for cutting-edge technology that delivers exceptional value and benefits to customers looking for top-of-the-line digital shift registers.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for harsh environments.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and assembly time.

Propagation Delay (tpd): 35 ns

Fast propagation delay ensures quick and efficient data processing.

Temperature Grade: MILITARY

Designed to operate in extreme temperature conditions, making it suitable for military applications.

Minimum fmax: 25 MHz

High maximum frequency allows for fast data transfer, enhancing overall performance.

Technical Specifications

Digital Shift Registers SNJ54178W attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

HOLD MODE

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-CDFP-F14

Length:

9.21 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

2.03 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

NEGATIVE EDGE

Width:

6.29 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54178W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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