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SNJ54164J

Texas Instruments

SNJ54164J by Texas Instruments

SNJ54164J by Texas Instruments is an 8-bit digital shift register with a propagation delay of 32ns, operating temperature range of -55 to 125°C, and max supply voltage of 5.5V. It is ideal for military applications requiring true output polarity and positive edge trigger type in a ceramic package with through-hole terminals.

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Dan-Mar Components

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

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Overview

Elevate your digital circuit designs with the Texas Instruments SNJ54164J digital shift register. Crafted with precision and reliability in mind, this innovative component boasts 8 bits of power with a nominal supply voltage of 5V. From military-grade screening to true output polarity, this rectangular package offers seamless integration and top-notch performance in applications ranging from communication systems to industrial controls. Trust in Texas Instruments to deliver quality and efficiency with every product, providing you with the value and advantage you need to stay ahead in today's competitive market. Upgrade your designs today with the SNJ54164J.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ensures durability and reliability, making the product suitable for harsh environments.

Screening Level: MIL-PRF-38535

Meets military-grade screening requirements, ensuring high quality and reliability.

No. of Bits: 8

Provides sufficient capacity for shift register operations in various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard operating voltage for compatibility with most electronic systems.

Propagation Delay (tpd): 32 ns

Fast propagation delay enables quick data transfer within the shift register.

Trigger Type: POSITIVE EDGE

Allows for precise triggering of data input, enhancing operational accuracy.

Technology: TTL

Utilizes TTL technology known for its reliability and simplicity in digital circuit design.

Minimum fmax: 25 MHz

Supports high-speed data processing, making it suitable for demanding applications.

Technical Specifications

Digital Shift Registers SNJ54164J attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

GATED SERIAL INPUTS (A AND B)

Count Direction:

RIGHT

Family:

TTL/H/L

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

54 mA

Propagation Delay (tpd):

32 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

SNJ54164J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-173-9776, 5962001739776, 5962-01-066-8117, 5962010668117, 5962-00-456-8098, 5962004568098, 5962-01-067-4965, 5962010674965, 5962-01-346-8477, 5962013468477

NIIN

001739776, 010668117, 004568098, 010674965, 013468477

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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