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SNJ54AHC273FK

Texas Instruments

SNJ54AHC273FK by Texas Instruments

SNJ54AHC273FK by Texas Instruments is an 8-bit latch with a propagation delay of 12.5 ns, suitable for military-grade applications. It operates at a supply voltage range of 2-5.5V and has a max frequency of 70 MHz, making it ideal for high-speed digital systems requiring fast response times. This chip carrier package features surface mount technology and is designed for use in environments with extreme temperatures ranging from -55 to 125°C.

Median Price

$23.769

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,153 parts In-Stock

1+ parts

$23.769

100+ parts

$21.128

1k+ parts

$15.535

10k+ parts

-

4,153

$23.769

$21.128

$15.535

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,558 parts In-Stock

1+ parts

$22.581

100+ parts

-

1k+ parts

-

10k+ parts

-

4,558

$22.581

-

-

-

Vyrian

USA . 2,910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,910

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,991 parts In-Stock

1+ parts

$20.200

100+ parts

-

1k+ parts

-

10k+ parts

-

3,991

$20.200

-

-

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AZTECH Wire

Italy . 970 parts In-Stock

1+ parts

$20.270

100+ parts

-

1k+ parts

-

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970

$20.270

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-

-

Corphita

USA . 4,763 parts In-Stock

1+ parts

$21.392

100+ parts

-

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-

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-

4,763

$21.392

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-

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Parana Technologies

USA . 1,353 parts In-Stock

1+ parts

$26.085

100+ parts

-

1k+ parts

$26.675

10k+ parts

-

1,353

$26.085

-

$26.675

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IDEA Electronic Components Group

UK . 1,010 parts In-Stock

1+ parts

$29.309

100+ parts

$27.844

1k+ parts

$26.378

10k+ parts

-

1,010

$29.309

$27.844

$26.378

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ChromeModa Solutions

Germany . 854 parts In-Stock

1+ parts

$29.309

100+ parts

$24.033

1k+ parts

-

10k+ parts

-

854

$29.309

$24.033

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

-

100+ parts

$26.425

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-

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2,157

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$26.425

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Microchip USA

USA . 1,365 parts In-Stock

1+ parts

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1,365

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Overview

Experience the superior quality and reliability of Texas Instruments with the SNJ54AHC273FK latches & flip-flops. Perfect for military-grade applications, this product offers fast propagation delay and true output polarity, making it an essential component for high-speed data processing. With a wide operating temperature range and low power consumption, customers can trust in the value and benefits that this versatile chip carrier provides. Maximize efficiency and performance with Texas Instruments' leading technology in every application.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 12.5 ns

The low propagation delay of 12.5 ns ensures fast and efficient operation of the latches and flip-flops in this product.

Surface Mount: YES

The surface mount capability makes it easy to integrate this product onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V nominal supply voltage provides a standard power input for the latches and flip-flops, ensuring compatibility with various systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments without compromising performance.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing and accurate signal processing, making this product suitable for applications requiring precise control.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Technical Specifications

Latches & Flip-Flops SNJ54AHC273FK attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Minimum fmax:

100 MHz

Trade Compliance

SNJ54AHC273FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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